Seiko Epson Corporation

Eiji Muramatsu

Masaru Kamimura

Shigetoshi Yamada

Kenji Uchiyama

Kenichi Maruyama

Seiichi Sakura

Kinichi Maeda

Kazuaki Furuichi

Kogo Endo

Minoru Ikegami

A liquid-crystal display device has a pair of substrates () which are opposite to each other and a semiconductor element which is directly joined to the substrate (). A portion other than an active surface () of the surfaces of the semiconductor element () is covered with a light-shielding member portion (). Since the light-shielding member () completely shields light irradiated from the upper and side surfaces of the semiconductor element () and a joint surface between the semiconductor element () and the substrate (), the semiconductor element () can be prevented from being erroneously operated.

Liquid crystal display device and electronic device using the same

In a liquid crystal display device for displaying a visible image by controlling the alignment of a liquid crystal disposed between a pair of transparent substrates (), a resistance element () for changing a voltage which will be imposed in the liquid crystal is directly formed on the transparent substrate () by ITO or the like. One or ones of the resistance branches () of a resistance pattern () are cut off by a laser beam to thereby change the resistance value of the resistance pattern () so that a voltage which will be imposed on the liquid crystal is adjusted. A peripheral circuit including a capacitor and/or the like may be directly formed on the transparent substrate () in addition to the resistance pattern (). The peripheral circuit may be formed to a portion located between the pair of transparent substrates (). The shape of the liquid crystal display device as a whole can be reduced by the formation of the resistance element and other peripheral circuit on the substrate of a liquid crystal panel.

Liquid crystal display device, method of manufacturing the same, and electronic equipment

A liquid-crystal display device has a pair of substrates ( ) which are opposite to each other and a semiconductor element which is directly joined to the substrate ( ). A portion other than an active surface ( ) of the surfaces of the semiconductor element ( ) is covered with a light-shielding member portion ( ). Since the light-shielding member ( ) completely shields light irradiated from the upper and side surfaces of the semiconductor element ( ) and a joint surface between the semiconductor element ( ) and the substrate ( ), the semiconductor element ( ) can be prevented from being erroneously operated.

Liquid crystal display device with a light-shielding portion

A method is provided for manufacturing an electro-optical device including a flexible wiring board having a conductive terminal electrically connected to an electro-optical display apparatus, whereby the flexible wiring board is electrically connected to a conductive terminal provided on a circuit board. A structural member is disposed between a first side of the electro-optical display and a first side of the flexible wiring board. The flexible wiring board is bent toward a second side of the structural member to oppose the circuit board and a conductive member is provided between the conductive terminal of the flexible wiring board and the conductive terminal of the circuit board. A force is applied to the structural member to attach the structural member to the circuit board, the force operable to compression-bond the conductive member to the conductive terminals of the flexible wiring board and the circuit board to establish an electrical connection therebetween.

Method for manufacturing an electro-optical device

A liquid crystal device having high reliability and permitting recognition of a connection state using ACF, and an electronic apparatus including the liquid crystal device, in which a pair of substrates and having electrodes and formed on the opposite surfaces thereof are opposed to each other, an overhang portion is provided on the substrate to project outward from the substrate , terminals are formed on the overhang portion to extend from the electrodes , and output terminals of an external circuit are electrically connected to the terminals through AFC so that conductive particles contained in the AFC cut into the terminals to form nicks or gouges which are visible through the transparent substrate

Electrooptic device, manufacturing method therefor with visual confirmation of compression bonding to terminals and electronic apparatus

A FPC board is manufactured by patterning copper foils which are bonded onto both sides of a base film having insulation and flexibility without an adhesive layer, and forming an input wiring and an output wiring on a mounting surface of an electronic component while forming a dummy wiring layer on the surface opposite the mounting surface. A dummy wiring layer is set to be slightly larger than an area where an IC chip is mounted, and has moisture resistance and light shielding properties. An input electrode of the IC chip is electrically connected to the input wiring and an output electrode 450 is electrically connected to the output wiring through electrically conductive particles dispersed into an adhesive agent , such as an epoxy resin, at an appropriate ratio, and the adhesive agent encapsulates the connection regions.

Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board

It is an object of this invention to provide a method for simply and quickly covering a semiconductor device with a coating resin. In the method for covering a semiconductor device,used for a liquid crystal panel,with a coating resin, a coating resin,being formed as a layer, the coating resin,is placed around the semiconductor device,and the semiconductor device,and its surroundings are covered with the coating resin,by curing the coating resin,so as to be protected from moisture. The coating resin,may be a coating resin which is curable through a chemical reaction by heating or an ultraviolet curing type resin or the like. If the coating resin,has a through-hole,or concavity so as to receive the semiconductor device,the position of the coating resin,to the semiconductor device,can always be set at a fixed position.

Method for coating semiconductor element with resin, coating resin, and liquid crystal display device

A liquid crystal display module (,) constructed such that a base end portion (,A) of a pin terminal (,) is joined to an input terminal (,) of a liquid crystal panel (,). A front end portion (,B) of the pin terminal (,) is disposed inwardly of the outer peripheral edge of the liquid crystal panel (,). This allows the portion where the pin terminal (,) is soldered to the circuit board (,) to be located at the back of the liquid crystal panel (,). The amount of space used for mounting the liquid crystal display module (,) onto the circuit board (,) can be minimized, that is it can be reduced by an amount based on the size of the liquid crystal panel,, thereby allowing very efficient use of space.

Electronic parts module and electronic equipment

A liquid crystal device is provided having a structure which allows an conductive connection to be achieved using only a panel supporting member, without necessitating an additional component such as a cover, thus reducing cost. The liquid crystal device,includes a liquid crystal panel,including a liquid crystal enclosed between a pair of substrates,and,, at least one of which includes a panel-side electrode terminal,, a light guide,for supporting the liquid crystal panel,on a main substrate,including a main substrate-side electrode terminal,, and an elastic connector,for conductively connecting the panel-side electrode terminal,and the main substrate-side electrode terminal,to each other. The light guide,includes an engagement pawl,for engagement with the main substrate,and a uniformly pressing member,for uniformly applying pressure to the elastic connector,. A pawl member is employed as the uniformly pressing member,which engages an engagement hole,thereby achieving a connection with the main substrate,so as to allowing the pressure applied to the elastic connector,to become uniform.

Liquid crystal device and electronic apparatus therewith

The present invention provides a circuit board connecting structure capable of connecting a circuit board, such as a flexible wiring board, and another circuit board by securing adequate contact pressure without the need for forming any special part thereby improving the reliability of contact and reducing the number of parts; an electro-optical device; electronic apparatus provided with the same; and a manufacturing method for an electro-optical device. The circuit board connecting structure electrically connects a conductive terminal,-,provided on a flexible wiring substrate,which is a first circuit board, and a conductive terminal,provided on a second circuit board,The connecting structure has a conductive member,provided between the first circuit board,and the second circuit board,to electrically connect the foregoing respective conductive terminals,-,and,a structural member,which is fixed to the first circuit board,and disposed to face one surface of the first circuit board,and a spacing member,provided between the structural member,and the first circuit board,The structural member,has a light guide,on which a liquid crystal display panel,is rested.

Circuit board connecting structure, electro-optical device, electronic apparatus provided with the same, and manufacturing method for electro-optical device

A liquid crystal display device 11 is provided comprising two substrates constituting a liquid crystal panel 12, a lead line 14 formed on at least one substrate 13a being covered with a mold 21, wherein the contour section 19 of the mold 21 covering the lead line 14 is composed of a high-viscosity mold material 17, and the inner section 23 is composed of a low-viscosity mold material 18. The viscosity of the high-viscosity mold material 17 is of a level of non-flowability when the mold material 17 is applied, whereas the viscosity of the low-viscosity mold material 18 is of a level of flowability when the mold material 18 is applied.

Liquid crystal display device including film

A liquid crystal display apparatus is provided which requires a small, thin and compact area for mounting semiconductor chips for driving liquid crystal and, accordingly, has a reduced cost. Semiconductor chips for driving liquid crystal are mounted on a surface (for example, a first layer) of a multi-layer substrate. The surface has input lines to the chips and output lines from the chips. The input lines have lands for connecting adjacent multi-layer substrates to each other. At least one intermediate layer is formed between an upper layer and a lower layer, the intermediate layer having bus lines. The bus lines and the input lines of the first layer are connected to one another via through holes in the first layer. The output lines of the first layer and terminals of the third layer are connected to one another via through holes in the first, second and third layers.

Growing community of inventors

Toyoshina-machi, Japan

Eiji Muramatsu