Sekisui Chemical Co., Ltd.

Eiji Miyamoto

Mitsuhide Nogami

A blow-off partis provided with a blow-off port' which is dimensioned small enough so as not to allow a blow-off stream to be blown off directly to a part of a wafer W which part is located at the more internal side of the wafer than the outer edge of the wafer W and not to be subjected to plasmatizing process. A suction partis provided with a suction portA in associating with the blow-off partThe suction portA is disposed proximate to the blow-off port&#x2032; and forms a suction stream oriented generally in the reverse direction with respect to the blow-off stream.

Plasma processing apparatus and method thereof

A nozzle head NH of a plasma processing apparatus comprises an annular inner holder, an annular inner electrodesurrounding this holder, an annular outer electrodesurrounding this electrode, and an annular outer holdersurrounding this electrode. The inner holderis provided with a plurality of boltsspacedly arranged in the peripheral direction and adapted to push the inner electroderadially outwardly. The outer holderis provided with a plurality of boltsspacedly arranged in the peripheral direction and adapted to push the outer electroderadially inwardly. Owing to this arrangement, the operation for disassembling, assembling and centering the annular electrodescan be carried out with ease.

Growing community of inventors

Hachioji, Japan

Eiji Miyamoto