Tokyo Electron Limited

Eiji Manabe

Yuji Mimura

Hisanori Hizume

Osamu Hirakawa

Shinichi Shinozuka

Takeshi Tamura

Yoshitaka Otsuka

Akira Fukutomi

Hiroshi Maeda

Yasuharu Iwashita

Shigeto Tsuruta

Hironori Tanoue

A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.

Bonding system and inspection method of inspecting combined substrate

A measuring method includes measuring a displacement A, placing an imaging unitat a position where the imaging unit is allowed to image a measurement mark MI and imaging the measurement mark M. In the measuring of the displacement A, the displacement Aof a surface of a combined substrate, which is composed of two sheets of substrates bonded to each other, on a side of the imaging unitat a position where the measurement mark Mfor position deviation measurement, which is provided within the combined substrate, is placed is measured. In the imaging of the measurement mark M, the measurement mark Mis imaged by the imaging unitwhile putting the measurement mark Min focus by moving a focal position back and forth with respect to a focal position which is previously set based on the displacement A

Measuring method and measuring device

In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.

Substrate holding apparatus and substrate holding method

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Koshi, Japan

Eiji Manabe