Ngk Spark Plug Company, Limited

Eiji Kodera

Kouki Ogawa

Manabu Sato

Kazushige Ohbayashi

Nobuyuki Hotta

Hidetoshi Mizutani

Hironori Sato

Noriyasu Sugimoto

Shigeru Taga

Kazuyuki Fujii

Makoto Baba

Hitoshi Nagura

Provided is a spark plug that includes a center electrode extending in an axial direction, a cylindrical insulator that holds the center electrode, and a cylindrical main metal fitting, which has a ground electrode at a tip portion thereof. The cylindrical main metal fitting includes a tool engagement portion for mounting the spark plug to an engine and a metal fitting-side fitting portion provided at a rear side of the main metal fitting opposite from the tip portion. The metal fitting-side fitting portion holds the insulator in a tightly fitted state in a radial direction.

Spark plug having a metal fitting portion for holding an insulator at a portion opposite a tip end

A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrateon which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrateand an IC chipmounted on the capacitor-built-in-type printed wiring substrate. A printed wiring substrateincludes a number of connection-to-IC substrate bumpsand a closed-bottomed capacitor accommodation cavityformed therein. A capacitoris disposed in the cavityand includes a pair of electrode groupsE andF and a number of connection-to-IC capacitor bumpsconnected to either one of the paired electrode groupsE andF. The connection-to-IC capacitor bumpsare flip-chip-bonded to corresponding connection-to-capacitor bumpson the IC chip. The connection-to-IC substrate bumpsare flip-chip-bonded to corresponding connection-to-substrate bumpson the IC chip

Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor

The invention is to offer such a dielectric ceramic enabling to simultaneously sinter with the low resistant conductor of Ag based metals and Cu based metals, having the excellent mechanical strength and exhibiting the excellent dielectric characteristics in the GHz zone. Mixed powders of Si: 20 to 30 weight %, B: 5 to 30 weight %, Al: 20 to 30 weight %, Ca: 10 to 20 weight %, and Zn: 10 to 20 weight % are prepared, melted, and rapidly cooled to produce glass frits. The glass frits are granulated and mixed with gahnite filler and titania filler which are inorganic filler powders. Subsequently, a binder is thrown into the powders to produce a composition of dielectric ceramic, and then is formed, followed by sintering. The mixed powders may contain at least one kind of alkali metal of Li, K and Na.

Dielectric ceramic

A printed-wiring substrate including a capacitor element, as well as a method for fabricating the printed-wiring substrate. An insulating substrateis molded by placing a capacitor elementin a mold and charging a resininto the mold. Therefore, the capacitor elementhaving a size (i.e., electrostatic capacitance) sufficient to suppress switching noise of an IC chipand stabilize operation power voltage can be disposed, while providing a dimensional margin. Since the possibility of failing to embed the capacitor elementdecreases, the printed-wiring substrate can be fabricated at reduced cost.

Printed-wiring substrate and method for fabricating the same

A ceramic printed circuit substrate includes a glass ceramic substrate and a surface circuit pattern, which is formed on the substrate by use of a conductive paste. The conductive paste contains conductive components of silver and platinum and filler components of molybdenum, tungsten, manganese dioxide, silicon dioxide and copper oxide. A ceramic green sheet and a surface circuit pattern formed thereon by use of the conductive paste are simultaneously fired at a temperature not higher than 1000&deg; C., thereby yielding the ceramic printed circuit substrate.

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Aichi, Japan

Eiji Kodera