Yamaichi Electronics Co., Ltd.

Eiji Kobori

Yuji Nakamura

Katsumi Suzuki

Takahiro Ishibashi

Takeyuki Suzuki

Ryo Ujike

Shuuji Kunioka

Takahiro Oikawa

Eisaku Tsubota

Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.

Electric connecting apparatus

An electrical connecting device for electrically connecting between two contacted articles, comprising a push member, a lock member, which holds one of the contacted articles in a predetermined mount position through the push member, a base member, to which the two contacted articles are mounted, an elastic member held on the base member, and a plurality of contacts held on the elastic member, and wherein the base member includes an upper base member and a lower base member, each including an accommodating recess, which accommodates the elastic member, the elastic member includes slits, respectively, holding the plurality of contacts, the plurality of contacts, respectively, include at least an upper contact arm having an upper contact portion and a lower contact arm having a lower contact portion, and the upper and lower contact portions of each of the plurality of contacts are structured to enable abutting against the elastic member.

Electrical connecting device

The probe pin cartridge is held in the cartridge accommodating region of the frame body when the slider members are in the locked state, and detachable from the cartridge accommodating region when the slider members are in the unlocked state by the operation of the operating buttons.

Socket for semiconductor device

In a state wherein front ends of latch membersA andB are apart from each other so that the upper surface of an alignment plate/positioning memberis outside, a pressing sectionPU of a heat sink memberis brought into contact with the periphery of a semiconductor device

Semiconductor device socket

Cover for a semiconductor carrier

Base for a semiconductor carrier

Semiconductor carrier

Growing community of inventors

Tokyo, Japan

Eiji Kobori