Dow Corning Corporation

Daikin Industries, Ltd.

Dow Corning Toray Company, Ltd.

Dow Silicones Corporation

Dupont Toray Specialty Materials Kabushiki Kaisha

Dow Toray Co., Ltd.

Eiji Kitaura

Peter Cheshire Hupfield

Haruhiko Furukawa

Tadashi Okawa

Takuya Ogawa

Steven Swier

Katsuhiko Imoto

Masaaki Amako

Masaru Nagato

Kent R Larson

Kazuhiro Nishijima

Keiji Wakita

Kouichi Ozaki

Masayuki Hayashi

Wataru Nishiumi

Hong Sub Kim

Tetsuo Shimizu

Tomohiro Iimura

Masayuki Onishi

Tetsuya Masutani

Motoshi Sasaki

Hiroshi Fukui

Masahiko Maeda

Toyohiko Fujisawa

Satoshi Onodera

Makoto Iwai

Son Thanh Phan

Keiichi Akinaga

Kousei Iwakawa

A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature Tof the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan &#x3b4;) of 1.6 or more at the temperature T.

Method for producing sealed optical semiconductor device

A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature Tof the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

An organic silicon compound is disclosed which is represented by a formula: (RSiO)SiR&#x2014;[SiRO][SiR]&#x2014;R&#x2014;R, wherein each of Rand Ris a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, Ris a divalent hydrocarbon group or an oxygen atom, Ris a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, Ris a monovalent group represented by (RO)RSi or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of Rand Ris a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

Organic silicon compound, surface treatment agent containing same, resin composition containing same, and gel or cured product of same

The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.

Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers

The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and a compound having a highly dielectric functional group.

There is provided a polyester coating composition having excellent action of preventing deposition of outdoor stain and stain caused by rainfall, being capable of extending a period of time (pot life) from the mixing to the coating, and comprising (A) a polyester resin, (B) one or more of fluorine-containing organosilicon compounds having a fluorine content of 5 to 30% by mass, (C) one or more of aliphatic hydrocarbon compounds having hydroxyl group and 1 to 10 carbon atoms, in which a part of hydrogen atoms bonded to carbon atom may be substituted by fluorine atoms and/or one or more of alkoxy compounds having 2 to 10 carbon atoms, in which a part of hydrogen atoms bonded to carbon atom may be substituted by fluorine atoms, and (D) an organic solvent.

Coating composition

There is provided a curable fluorine-containing polymer composition which is rapidly cured at relatively low temperature by hydrosilylation reaction to form a coating film having not only high hardness and flexibility but also water- and oil-repellency, thereby giving stain-proofing effect for a long period of time, especially maintaining property of removing and wiping-off stain. The curable fluorine-containing polymer composition comprises a fluorine-containing polymer comprising a fluorinated ethylenic monomer unit and an un-fluorinated ethylenic monomer unit, in which a part or the whole of the un-fluorinated ethylenic monomer units are units represented by the formula: where Ris hydrogen atom or methyl group; Ris a hydrocarbon group having ethylenic C&#x2550;C; X is &#x2014;C(O)NH&#x2014; or &#x2014;C(O)&#x2014;; Ris &#x2014;O&#x2014;, &#x2014;O[CH(R)]O&#x2014;, &#x2014;(CH)O&#x2014;, &#x2014;OC(O)&#x2014;(CH)O&#x2014; or &#x2014;(CH)OC(O)&#x2014;(CH)O&#x2014;, where Ris &#x2014;H, &#x2014;OH, &#x2014;CHOH or &#x2014;O&#x2014;X&#x2014;R, a siloxane compound having hydrogen atom bonded to silicon atom, a catalyst for hydrosilylation reaction, and a siloxane compound having no hydrogen atom bonded to silicon atom.

Curable fluorine-containing polymer composition

A substrate is surface treated using a composition for forming a film that comprises (A) an organoalkoxysilane, (B) an organopolysiloxane having a silicon-bonded hydrogen atom, and (C) a condensation reaction catalyst. This composition for forming a film can form a highly hydrophobic water repellent film provided with sufficient water shedding performance. It is possible to provide a highly hydrophobic substrate such as a heat dissipating body.

Composition for forming film

A curable polymer composition that is quickly curable to form a cured article having excellent adhesion and followability to a substrate and at least including (A) an acrylic copolymer having a hydrogen atom bonded to a silicon atom, (B) a compound having at least two aliphatic unsaturated bonds in one molecule thereof, (C) a fluoroolefin copolymer including vinylidene fluoride as main component, and (D) a catalyst for hydrosilylation reaction.

Curable polymer composition

Growing community of inventors

Ichihara, Japan

Eiji Kitaura