Sumitomo Chemical Company, Limited

Eiji Kishikawa

Shinichi Morishima

Masaya Shimogawara

Masato Shakutsui

According to an embodiment, a substrate with an electrode is a substrate with an electrodefor manufacturing an organic deviceincluding a first electrode, an organic functional layer, and a second electrode. The substrate with an electrode includes a support substrate, a first electrode provided on an inner side of a device formation area DA on a surfaceof the support substrate, and an antistatic conductive portionprovided on the surface described above and electrically connected to the first electrode.

Electrode-attached substrate, laminated substrate, and organic device manufacturing method

A method for manufacturing an organic deviceaccording to an embodiment includes: a film forming step of continuously forming first to N-th layers (N is an integer of 2 or more) on a first electrode layerformed on a main surfaceof a flexible substrate while continuously conveying the flexible substrate, wherein in the film forming step, the first to N-th layers are sequentially formed on the first electrode layer by supplying materials of the first to N-th layers from first to N-th film forming sources to the flexible substrate through first to N-th shielding parts arranged between the first to N-th film forming sources and the flexible substrate, the first to N-th shielding parts are fixed in a conveyance direction of the flexible substrate in a state of being spaced apart from the flexible substrate, and a shielding area due to at least one shielding part of the first to N-th shielding parts is different from a shielding area due to other shielding part.

Method for manufacturing organic device, and film forming device

A production method for an organic EL element includes a step of forming an organic EL section on an organic EL section arrangement area in a first electrode section while conveying an electrode-attached substrate in a first direction, a step of forming a band-shaped conductive film along the first direction to cover the organic EL section and at least a part of an external connection area in the first electrode section while conveying the electrode-attached substrate on which the organic EL section is formed in the first direction, and a step of forming a groove section that separates the conductive film into a first part and a second part being a second electrode section by removing the conductive film in a predetermined area in a second direction while conveying the electrode-attached substrate on which the conductive film is formed in the first direction, and extends in the first direction.

Organic EL element production method and organic EL element having conductive member on external connection area of first electrode

A method for producing an organic device, includes: first forming steps Sand Sof producing a support substratewith an organic functional layer; a winding step Sof winding the support substratewith an organic functional layer and a protective film; a peeling step Sof feeding out the protective filmand the support substratehave been wound in, and peeling off the protective film; a heating step Sof heating the support substratewith an organic functional layer after the peeling step S; and a second forming step Sof forming at least one layer selected from the second electrode layerand an organic functional layernot formed in the first forming step Sand being one of the organic functional layers comprising the multiple organic functional layers, after the heating step S

Method for producing organic device

A method of manufacturing an organic EL element () includes: a step of forming a first electrode layer (), an organic functional layer (), and a second electrode layer () on a substrate (), a step of detecting a defective portion after forming the second electrode layer (), a step of removing the second electrode layer () in the defective portion by irradiating the defective portion with a laser beam (L) from the second electrode layer () side when the defective portion has been detected, and a step of forming a sealing layer () after removing the second electrode layerin the defective portion.

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Osaka, Japan

Eiji Kishikawa