Kyocera Corporation

Eiji Kimura

Katsuhiro Ogasawara

Tsuyoshi Teramura

Hiroyuki Miura

Shinsuke Kawamori

Toshihiro Saito

A crystal device includes a rectangular shaped substrate, a mounting frame which is along an outer circumferential edge of a lower surface of the substrate on its short-side sides and configures a recessed part, electrode pads on an upper surface of the substrate, connection pads on the lower surface of the substrate in the mounting frame, a crystal element mounted on the electrode pads, a temperature sensing element mounted on the connection pads, and a lid air-tightly sealing the crystal element. The electrode pads and the recessed part do not overlap in a plane perspective view.

Crystal device and electronic apparatus using this crystal device

A piezoelectric vibration device includes an element mounting member provided with a recessed part, a vibration element held in the recessed part, and a lid closing the recessed part. The element mounting member includes an insulating base body including an inner bottom surface of the recessed part and an inner circumferential surface of the recessed part surrounding the inner bottom surface, a pair of signal terminals which are located on an outer surface of the base body and are electrically connected to the vibration element, a GND terminal which is located on the outer surface of the base body, and a shield film which is superposed on the inner circumferential surface of the recessed part and is electrically connected to the GND terminal.

Piezoelectric vibration device

A crystal unit is provided with a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along the outer circumferential edge of the upper surface and which is provided on the lower surface of the substrate by joining joining terminals provided along the outer circumferential edge of the lower surface of the substrate and its joining pads, a crystal element which is mounted on electrode pads which are provided on the upper surface of the substrate in a region surrounded by the frame, a thermosensitive element which is mounted on connection pads which are provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Growing community of inventors

Higashiomi, Japan

Eiji Kimura