Nissha Co., Ltd.

Eiji Kawashima

Chuzo Taniguchi

Yasuhide Fukada

Jun Sasaki

Tatsuo Ito

Yoshihiro Sakata

Daichi Hama

Yasuisa Takinishi

Yusuke Ueno

Junichi Shibata

Ryomei Omote

Koji Okamoto

Takeshi Nishimura

Hiroyuki Konishi

Kazuto Nakamura

Hiroyuki Nagai

Tomohiro Yamaoka

Toshitsugu Fujimura

Masaru Terashita

Takenori Yoshida

Ryouki Kubomoto

Yuki Naito

Koji Asai

Akihiro Yoshimura

Yuu Kuwataka

Rokusuke Takemura

Toru Okada

A decorative molded article transmits a radio wave handled by a wireless device and illuminates a specific portion by a light irradiated from a light emitting device. A first reflective layer is formed to have a first opening portion in a back surface of a molded body, reflects light incident from the first opening portion, and transmits the millimeter wave. A first coloring unit transmits the millimeter wave and colors the light incident from the first opening portion to generate a first colored light. A shielding layer of a decorative sheet is fixedly secured to a translucent film, transmits the millimeter wave, and shields the first colored light, and has a second opening portion arranged in the specific portion to take out the first colored light from the molded body to a front of a front surface.

Decorative molded article and manufacturing method for same

A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opposite to a side of the housing of the base film, and an electronic component connected to the circuit pattern layer and mounted on a surface opposite to the side of the housing of the base film. The electronic component mounting film is integrated with the housing. An impact absorbing layer covers the electronic component of the electronic component mounting film and a periphery of the electronic component. The circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.

Electronic component-equipped resin casing and method for producing same

A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.

Molded article, electrical product and method for producing molded article

An automotive interior component is provided which includes: an infrared sensor that includes an emission unit and a reception unit, the emission unit emitting infrared rays to an object, and the reception unit receiving the infrared rays reflected by the object; a molded body in which the infrared sensor is installed; and a surface material disposed so as to cover the infrared sensor, the surface material transmitting the infrared rays.

Automotive interior component

A switch cap for a switch device that can reduce a pressing error of a switch is provided. A three-dimensional first cap main body moves by a force applied to a first abutting portion from a finger which is an operator. A first sensor is disposed in the first cap main body, and detects abutting or approach of the finger to the first abutting portion. A first transmission member is fixed to the inside of the first cap main body, and moves together with the first cap main body for first switching to transmit movement of the first cap main body to a push button which is a predetermined location of a switch device. A first sensor is formed in a flexible printed circuit board (FPC) disposed in the first cap main body, and the FPC is fixed by the first transmission member and the first cap main body.

Method of manufacturing switch cap, switch cap, and switch device

Object: A plurality of problems of an electromagnetic wave transmissive cover to be installed in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave are simultaneously eliminated. Resolution means: An electromagnetic wave transmissive coveris a member to be installed in an electromagnetic wave irradiation direction of a millimeter wave radarusing an electromagnetic wave, and includes a colored resin member, a transparent resin member, and a transparent heater film. The transparent resin memberis provided on an opposite side to the millimeter wave radarof the colored resin member. The transparent heater filmis provided on the opposite side to the millimeter wave radarof the colored resin member, includes a wiring pattern formed by copper plating or etching, and has electromagnetic wave transmissivity.

Electromagnetic wave transmissive cover and method for manufacturing the same

To provide a cylindrical printed board in which a processing shape is maintained, and a printed-board-integrated molded article in which the cylindrical printed board is integrated with an inner wall of a hole portion in a molded article. A cylindrical printed boardaccording to the present invention is a printed boardincluding an insulator substrateand a conductor patternformed on the insulator substrate, wherein the printed boardis rolled beyond one full circle to form a cylindrical shape. In addition, a printed-board-integrated molded articleincludes a molded articleconstituting a casing that has a cylindrical part, and the cylindrical printed boardthat is integrated with an inner wallof a hole portionin the cylindrical part of the molded article

Cylindrical printed board and printed-board-integrated molded article

To provide a decorative molded article that enables clear visual recognition of an arbitrary pattern on a surface of a skin material when a light source is turned on. The decorative molded article is a decorative molded article capable of being illuminated by a light source on a back surface and configured so that a skin material having an OD value of 1 or more and 3.5 or less, a light-shielding layer having an arbitrary pattern, and a transparent molded body are laminated together in sequence, and so that a color difference &#x394;E between a light emitting unit and a non-light emitting unit of the skin material is 50 or more when the light source is turned on. The decorative molded article may further include a nonwoven fabric between the skin material and the light-shielding layer, or between the light-shielding layer and the molded body.

Decorative molded article

A display panel is attached to an appliance that includes first and second light sources, in which one of the first and second light sources is capable of being turned off when the other is turned on. The display panel basically includes a molded body, a front-side decorative layer, and a sheet-like member. The display panel is capable of individually illuminating a plurality of graphics, which is simultaneously molded and decorated, with light passing through a molded resin. In particular, a first graphic is illuminated in a first window by turning on the first light source, while a first back-side light-shielding region and a second front-side light-shielding region prevent a second graphic from being illuminated. The second graphic is illuminated in a second window by turning on the second light source, while a second back-side light-shielding region and a first front-side light-shielding region prevent the first graphic from being illuminated.

Display panel

A multipoint-measurement strain sensor which is free of a conduction failure originated from slippage at the time of lamination and which can reduce the material cost, and a method for producing the multipoint-measurement strain sensor are provided. A multipoint-measurement strain sensorof the present invention includes a substrate film, a plurality of strain-sensing partsformed on a first main surfaceof the substrate film, routing circuitsformed, in correspondence with the respective strain-sensing parts, on a second main surfaceof the substrate film, and having outer connection terminalsnear an outer edge of the substrate film, and a conductive pasteto fill via holessuch that each of the strain-sensing partsis connected to the corresponding routing circuit

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Kyoto, Japan

Eiji Kawashima