Japan Science and Technology Agency

Arakawa Chemical Industries, Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Pelnox Co., Ltd.

Pelnox, Ltd.

Eiji Iwamura

Naohiro Takashima

Masaki Kobayashi

Hirokatsu Itou

Yasutaka Morozumi

Naoya Takahashi

Yuichi Ishii

Ken Kasashima

Natsuki Kubo

One chip-shaped electronic componentof the present invention has a substrate, and a termination electrode layerformed on an end face of the substrate. The termination electrode layeris made of a mixed material that contains an electrically-conductive substance (a') (containing carbon (a) as one type of the electrically-conductive substance (a&#x2032;)), whisker-like particles (b) covered with the electrically-conductive substance (a&#x2032;), flake-like particles (c) having electroconductivity, and a tetrafunctional hydroxyphenyl type epoxy resin (d) having a molecular weight of 450 or more and less than 800. In addition, a mass ratio of the flake-like particles (c) is 3/7 or more and 9 or less when the whisker-like particles (b) is assumed to be 1.

Chip-shaped electronic component

The present invention provides a heat dissipating coating composition in a liquid or paste form for application to a heat generating article, comprising an infrared absorbing binder resin (A), infrared absorbing inorganic particles (B), and an organic solvent, having such proportions of the component (A) and the component (B) that the component (A) is 10 to 70 vol % and the component (B) is 90 to 30 vol % based on the total of both components being 100 vol %, and satisfying conditions 1, 2, and 3 specified herein, and also provides a heat dissipating coating film obtained by applying the heat dissipating coating composition to a heat dissipating article and then thermally curing the composition.

Heat dissipating coating composition and heat dissipating coating film

A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): HN&#x2014;(CH)&#x2014;X&#x2014;(CH)&#x2014;NH(wherein n represents an integer of 1 to 6 and X represents &#x2014;NH&#x2014;CHCH&#x2014;NH&#x2014; or a piperazine residue).

Lead-free solder flux and lead-free solder paste

The present invention provides a novel carbon-based material in which carbons different in property are combined in such a manner as to be applicable to a device. The carbon-based thin film provides a carbon-based thin filmincluding first phasesthat contain amorphous carbon and extend in a film thickness direction, and a second phasethat contains a graphite structure and intervenes between the first phases. In the thin film, at least one selected from the group consisting of the following a) to e) is satisfied: a) the second phase contains more graphite structures per unit volume than the first phases; b) a density of the second phase is larger than that of the first phases; c) an electric resistivity of the second phase is lower than that of the first phases; d) an elastic modulus of the second phase is higher than that of the first phases; and e) in the second phase, a basal plane of the graphite structure is oriented along the film thickness direction.

Carbon-based thin film, and process for producing the same, and member using the thin film

There are provided hydrogen storage materials comprising a first region composed primarily of an amorphous carbon containing at least one metal element selected from the group consisting of Ti, Zr, Hf and Y, and a second region composed primarily of an amorphous carbon having a density lower than that of the first region.

Growing community of inventors

Kanagawa, Japan

Eiji Iwamura