Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Eiji Iso

Isao Ida

Keita Muneuchi

Takashi Tomohiro

Kenichi Araki

Noriko Shimizu

Yoshifumi Maki

Hiroshi Okuizumi

Takao Kawachi

Hirotsugu Tomioka

Shinichiro Izumi

Hiroshi Marusawa

Noriyuki Ookawa

Yoshiharu Satou

Tsuyoshi Kawada

Yuki Kitashima

A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

Electronic component and manufacturing method for the same

An inductor includes a body containing soft magnetic powder and resin, a coil embedded in the body, outer electrodes on the body, and a protective film on the surface of the body. The protective film has a thickness of 10 μm or more and contains silica particles and resin. In the protective film, the silica particles have an average diameter of 15 nm to 75 nm, and the percentage by weight of the silica particles to the resin is between 150% and 250%.

Inductor

An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.

Electronic component and method for manufacturing the same

A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.

Coil component and method of manufacturing the coil component

A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.

Manufacturing method for electronic component including electrode formed by removal of insulating layer by laser light

In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.

Electronic component and method of manufacturing same

An electronic component includes at least one coil including a winding part and lead-out end parts at both ends thereof, and a magnetic molded body having a mounting surface with the coil incorporated therein. The lead-out end parts are led out toward the mounting surface such that end surfaces of the lead-out end parts are arranged on the same plane as the mounting surface.

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Nagaokakyo, Japan

Eiji Iso