Mitsui Chemicals Tohcello, Inc.

Mitsui Chemicals, Inc.

Mitsui Chemicals Tochello, Inc.

Mitsui Chemical Tohcello, Inc.

Eiji Hayashishita

Mitsuru Sakai

Katsutoshi Ozaki

Hirokazu Takahashi

Makoto Kataoka

Yoshihisa Saimoto

Setsuko Oike

Kazuhide Fukura

In order to provide a component manufacturing apparatus and a component manufacturing method that can normally chuck and fix a component holding film to a chuck table in a heated state, the present component manufacturing apparatusincludes a chucking and fixing meansthat chucks and fixes a component holding film to a heated chucking surface, and a preventing meansthat prevents heat convection, occurring on the chucking surface, from contacting the film. The present component manufacturing method includes a setting step of chucking and fixing the film to the heated chucking surface, and the setting step includes a preventing step of preventing heat convection, occurring on the chucking surface, from contacting the film.

Component manufacturing device and component manufacturing method

A component manufacturing method includes a step of obtaining a holding tool. The holding tool includes: a frame body having an opening; and a holding film placed on the frame body. The step is a step of placing the holding film on the frame body while stretching the holding film in at least three different directions or in all directions to the frame body. The holding film includes a base layer and a holding layer. The holding tool forming device includes: a mechanism that pushes a plain film from a base layer side to bring about a stretched state; a mechanism that fixes the plain film to the frame body such that the stretched state is maintained; and a mechanism that isolates an unnecessary portion from the plain film to obtain the holding film.

Component producing method, holding film, and holding tool forming device

A component-manufacturing tool includes a frame body and a holding film covering an opening, wherein the frame body includes a first frame and a second frame; the holding film includes a base layer and a holding layer provided on one surface of the base layer, and the holding film is sandwiched and held between the first frame and the second frame in a stretched state; and a ratio R(=E′(100)/E′(25)) of an elastic modulus E′(100° C.) of the base layer to an elastic modulus E′(25° C.) of the base layer is 0.2≤R≤1, and E′(25) is 35 MPa or more and 3500 MPa or less. A component-manufacturing method includes a component holding step of holding components to the holding layer of the component-manufacturing tool; and a chucking step of chucking and fixing the holding film, to which holds the components, to a surface of a heated chuck table.

Component-manufacturing tool and component-manufacturing method

Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

Film for component manufacture and component manufacturing method

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and one or two or more electronic components affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in the electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand of the electronic component testing apparatus in a defined manner; a step (C) of evaluating the properties of the electronic component in a state of being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a step (D) of picking up the electronic component from the adhesive film after the step (C). A defined sample stand is also provided.

Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E'(160)/E&#x2032;(&#x2212;40)) of the elastic modulus of the base layer at 160&#xb0; C. to the elastic modulus of the base layer at &#x2212;40&#xb0; C. is RE&#x2265;0.01, and the elastic modulus E&#x2032;(&#x2212;40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

Film for manufacturing semiconductor parts

An adhesive laminate film has a heat-resistant resin layer, a flexible resin layer, and an adhesive resin layer in this order, a peel strength Pbetween the heat-resistant resin layer and the flexible resin layer, which is based on JIS Z0237 and measured under defined conditions, is equal to or more than 0.01 N/25 mm and equal to or less than 2.0 N/25 mm, and a peel strength Pbetween the heat-resistant resin layer and the flexible resin layer after a thermal treatment of the adhesive laminate film at 160&#xb0; C. for four hours is equal to or more than 0.05 N/25 mm and equal to or less than 1.5 N/25 mm.

Adhesive laminate film and method for manufacturing electronic device

Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (&#x3bc;m) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (&#x3bc;m) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

Provided is a component-manufacturing film that includes a first region Sand a second region Sdisposed so as to surround the region S; the region Sis formed of a base layer and an adhesive layer provided on one surface side of the base layer; the region Sis formed of the base layer, the adhesive layer, and an additional layer affixed onto the layer. In the temperature range of 190&#xb0; C. or lower, a tensile elastic modulus of the additional layer is equal to or greater than the tensile elastic modulus of the base layer. Further provided are a component-manufacturing tool and method, the latter including a component fixing step; a film placement step of performing placement so that the boundary between the region Sand the region Sis located inside with respect to an edge of the chuck table; a chucking step; and a heating step.

Component-manufacturing film, component-manufacturing tool, and component-manufacturing method

A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure () including an adhesive laminate film () having a heat-resistant resin layer (), a flexible resin layer () and an adhesive resin layer () in this order, and a first semiconductor component () adhered to the adhesive resin layer () and having a first terminal (); (B) a step of performing solder reflow processing on the first structure () in a state where the first semiconductor component () is adhered to the adhesive resin layer (); and (C) a step of, after the step (B), peeling the heat-resistant resin layer () from the adhesive laminate film ().

Method for manufacturing semiconductor device

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and at least one electronic component affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in an electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand with the adhesive film interposed between the electronic component and the electronic component installation region, the electronic component testing apparatus being provided with a probe card at a position facing the sample stand and includes a probe terminal; a step (C) of evaluating the properties of the electronic component while being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a subsequent step (D) of picking up the electronic component from the adhesive film.

A method for manufacturing a semiconductor device according to the present invention includes at least the following four steps: (A) a step of preparing a structure () including an adhesive laminate film () having a heat-resistant resin layer (), a flexible resin layer () and an adhesive resin layer () in this order, and one or two or more semiconductor chips () adhered to the adhesive resin layer (); (B) a step of confirming an operation of the semiconductor chips () in a state of being adhered to the adhesive resin layer (); (C) a step of, after the step (B), peeling the heat-resistant resin layer () from the adhesive laminate film (); and (D) a step of, after the step (C), picking up the semiconductor chips () from the adhesive resin layer ().

A method for manufacturing a semiconductor device of the present invention includes at least following four steps. (A) A step of preparing a structure having an adhesive film having a radiation-curable adhesive resin layer and one or two or more semiconductor chips adhered to the adhesive resin layer ; (B) a step of irradiating the adhesive film with a radiation to crosslink the adhesive resin layer; (C) a step of, after the step (B), confirming the operation of the semiconductor chips in a state of being adhered to the adhesive resin layer; and (D) a step of, after the step (C), picking up the semiconductor chips from the adhesive resin layer.

Growing community of inventors

Nagoya, Japan

Eiji Hayashishita