Sony Semiconductor Solutions Corporation

Sony Corporation

Eiichirou Kishida

Yuji Takaoka

Hirokazu Seki

Yuta Momiuchi

Kiyohisa Tanaka

Hirokazu Nakayama

Miyoshi Togawa

Atsushi Tsukada

Emi Nishioka

Daisuke Nakatsuru

Hiroyuki Kaji

Naoki Yamashita

To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.

Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus

The present technology relates to a semiconductor device including: a solid-state image sensor having a pixel array unit in which a plurality of pixels each having a photoelectric conversion element is two-dimensionally arranged in a matrix; and a flexible printed circuit having wiring adapted to connect a pad portion provided on an upper surface side to be located on a light receiving surface side of the solid-state image sensor to an external terminal provided on a lower surface side opposite to the upper surface side, in which the flexible printed circuit is arranged along respective surfaces of the solid-state image sensor such that a position of an end portion located on the upper surface side becomes a position different from a position in a space above the light receiving surface.

Image sensor package with flexible printed circuits

The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.

Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients

[Object] To provide a solid-state imaging device, with which degradation of properties of a solid-state image sensor under the influence of magnetic force lines generated from wiring arranged in the package is prevented, and a solid-state imaging apparatus including the same. [Solving Means] A solid-state imaging device according to the present technology includes a package, a seal glass, a solid-state image sensor, and a shield. The package includes wiring inside and a recess. The seal glass is joined to the package and closes the recess. The solid-state image sensor is housed in a space formed by the recess and the seal glass. The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.

Solid-state imaging device and solid-state imaging apparatus

Growing community of inventors

Kumamoto, Japan

Eiichirou Kishida