Matsushita Electric Industrial Co., Ltd.

Eiichiro Tanaka

Shinji Fujiwara

Tetsuro Nakamura

Masanori Watanabe

Takahiko Murata

Akio Takimoto

Masahiro Nakagawa

Hisahito Ogawa

Hirofumi Wakemoto

Shigehiro Sato

Junko Asayama

Tetsuroh Nakamura

Fumiko Yokotani

Yuka Kajita

Kouki Hongou

Koji Ikeda

Ryoichi Takayama

Osamu Kawasaki

Koji Akiyama

Kousaku Yano

Masayoshi Miura

Yuji Takashima

Koji Matsuo

Isaku Kanno

Osamu Watanabe

Etsuya Takeda

Kenji Tomita

Yukimasa Kuramoto

Yoshitaka Aoki

Kyoko Onomichi

Chisato Sakahara

Formed on a surface of an oscillation plate on the side of a head main body portion is an intermediate layer having a window portion through which a displacement portion of the oscillation plate is exposed to a pressure chamber. The intermediate layer and a compartmenting wall of the main body portion are adhered together by an adhesive of electro-deposition resin. The intermediate layer is formed of copper, having a thickness of 5 &mgr;m, so that, when a part of the adhesive is forced out, such a forced-out adhesive portion will not adhere to the displacement portion of the oscillation plate.

Ink jet head and method for the manufacture thereof

The present invention relates to a linear beam irradiator, more specifically to a linear beam irradiator for using light conductor, comprising a light conductor having light permeability, a light refraction & reflection area provided on one side face in the longitudinal direction of said light conductor, and a light source provided in a way to cover the light refraction & reflection area as well as a light source disposed at one end or both ends of said light conductor. This construction makes it possible to irradiate a linear light beam from the other side face of the light conductor corresponding to said light refraction & reflection area With this construction, it becomes possible to reduce the deviation of illuminance of said linear light beam, sharply improve the transmission efficiency of light and greatly reduce the number of LED chips disposed at the light source. Moreover, this also enables a cost reduction.

Linear beam irradiator having a varying cross-sectional size

An ink jet recording apparatus is disclosed, which apparatus has a pressure chamber that holds an ink liquid, and a nozzle communicating with the pressure chamber for discharging the ink liquid when pressure is applied to the pressure chamber. The pressure chamber has a diaphragm disposed therein. A piezoelectric element made of a monocrystalline or polycrystalline piezoelectric member highly oriented along a polarization axis showing perovskite structure, and mainly composed of lead zirconate titanate or barium titanate, is used to vibrate the diaphragm. When a specified voltage is applied to the piezoelectric element, it causes the ink liquid in the pressure chamber to be discharged into a recording medium at the front side of the nozzle.

Ink jet recording apparatus including a pressure chamber and pressure applying means

A linear illumination device of the present invention includes: a guide made of a light transmitting material extending in a first direction, having a side face and at least one end face; at least one light emitter for allowing light to enter interior of the guide from the at least one end face of the guide; and a light diffusing section formed on part of the side face of the guide, for diffusing the light incident thereon by refraction, wherein at least part of the light entering the interior of the guide goes out from part of the side face of the guide facing the light diffusing section, thereby providing substantially linear illumination light along the first direction.

Linear illumination device

A linear illumination device of the present invention includes: a guide made of a light transmitting material extending in a first direction, having a side face and at least one end face; at least one light emitter for allowing light to enter interior of the guide from the at least one end face of the guide; and a light diffusing section formed on part of the side face of the guide, for diffusing the light incident thereon, wherein at least part of the light entering the interior of the guide goes out from part of the side face of the guide facing the light diffusing section, thereby providing substantially linear illumination light along the first direction.

An alternating copolymer comprising a repeating unit of the formula:

Photosensitive material and process for the preparation thereof

A direct contact type image sensor includes an optical fiber array plate including a transparent substrate and an optical fiber array and having a lower face brought into close contact with an original document. A semiconductor image sensor chip including a photosensor array is mounted on an upper face of the optical fiber array plate by transparent photo-setting and insulating resin. A circuit conductive layer is formed on an upper face of the transparent substrate, and a bump electrode is formed on a lower face of the semiconductor image sensor chip so as to be brought into contact with the circuit conductive layer. A light source is provided for illuminating the original document. The optical fiber array plate is formed, on the upper face, with a slit for allowing light from the light source to pass therethrough. A first light shielding layer is provided at other portions of the lower face of the optical fiber array plate than that corresponding to the optical fiber array, and a second light shielding layer is provided at other portions of the upper face of the optical fiber array plate than those corresponding to the optical fiber array and the slit.

Direct contact type image sensor and its production method

Organic polymer and preparation and use thereof

A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; e transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting substrate. The image sensor chip and the light-interrupting portion serve as an optical throttle for the light beam.

Direct-contact type image sensor device, an image sensor unit, and

Organic polymer and preparation and use in crystal spatial light

A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; a transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting substrate. The image sensor chip and the light-interrupting portion serve as an optical throttle for the light beam.

A semiconductor device according to the present invention includes: a light-transmitting substrate having a first surface and a second surface; a circuit conductor layer formed on the first surface of the light-transmitting substrate; a semiconductor chip having electrodes formed on a surface thereof, the semiconductor device being mounted face-down on the first surface of the light-transmitting substrate; a photo-thermal cross-linkable insulating resin layer for fixing the semiconductor chip on the light-transmitting substrate; a plated metal layer formed on at least a portion of the circuit conductor layer, the electrodes of the semiconductor chip being connected to the circuit conductor layer through the plated metal layer; an alloy layer formed in an abutting portion between each plated metal layer and the circuit conductor layer; and a second alloy layer formed in an abutting portion between each electrode and each plated metal layer, the alloy layers being formed by melting and recoagulating the plated metal layer upon the circuit conductor layer.

Semiconductor device, an image sensor device, and methods for producing

Growing community of inventors

Kishiwada, Japan

Eiichiro Tanaka