Shin-etsu Chemical Co., Ltd.

Eiichi Tabei

Shigeru Mori

Motoo Fukushima

Akira Hayashida

Akira Yamamoto

Kei Miyoshi

Yoshinori Hida

Hisashi Umehara

Masaki Tanaka

Masayuki Ikeno

Kunio Itoh

Hideyoshi Yanagisawa

Noriyuki Meguriya

Yoshitaka Hamada

Toshiyuki Ozai

Mitsuhiro Takarada

Tomoyoshi Furihata

Kazumi Noda

Tomoyuki Goto

Mitsuo Umemura

Kazuyasu Sato

Yoshifumi Harada

Seizi Katayama

Masaya Arakawa

Teiichi Mutoh

Satoshi Onai

An addition curable type silicone resin composition includes (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (RRSiO)(RRSiO)(RSiO)(RSiO)(R(OR)SiO)(SiO), (c) an organohydrogen polysiloxane represented by RHSiO, (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an Si&#x2014;O&#x2014;Ce bond, and an Si&#x2014;O&#x2014;Ti bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

Addition curable type silicone resin composition, process for producing composition, and optical semiconductor apparatus

An organic modified silicone resin composition includes: (A) an addition reaction product having two addition reactive carbon-carbon double bonds in one molecule, being a product of an addition reaction of (a) a compound shown by the general formula (1) having SiH groups and (b) a polycyclic hydrocarbon having addition reactive carbon-carbon double bonds; (B) a siloxane having an SiH group and an organic group substituted with an alkoxysilyl group and/or a siloxane having an SiH group and an organic group substituted with an epoxy group; (C) a compound having three or more SiH groups in one molecule; (D) a catalyst; and (E) fumed inorganic oxide. The formulation amount of the component (E) is 1 to 10 parts by mass relative to 100 parts by mass of the total amount of the components (A), (B), and (C); and having a viscosity of 10 to 100 Pa&#xb7;s at 25&#xb0; C. 

Organic modified silicone resin composition

A curable resin composition to which at least phosphor particles and nanoparticles having a primary particle size of 1 nm or more and less than 100 nm are added, wherein the nanoparticles are dispersed in the form of secondarily aggregated particles having an average particle size of 100 nm or more and 20 &#x3bc;m or less in terms of volume Q3 is provided for an optical semiconductor apparatus in which when a sealant obtained by dispersing phosphor particles in a curable resin composition having a low viscosity is filled into a package substrate, the dispersion state of the phosphor particles is not changed at the early and late stages of the fabrication, specifically the amounts of the phosphor particles to be contained at the early and late stages are the same, and the color rendering property can be stably maintained, a hardened material thereof, and an optical semiconductor apparatus.

Curable resin composition, hardened material thereof, and optical semiconductor apparatus

Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.

Silicone-sealed LED

Provided is a curable organosilicon composition comprising (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule, and (C) a hydrosilylation reaction catalyst. The curable organosilicon composition yields a cured product that has a high degree of hardness and excellent transparency, crack resistance and heat resistance, and is useful as a curable silicone material, an encapsulating material for optical devices such as optical elements, an encapsulating material for other electronic devices such as semiconductor elements, and an electrically insulating coating material.

Curable organosilicon composition and cured product thereof

Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.

Method of sealing semiconductor element mounted on gold-plated printed circuit board

Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.

Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device

A curable silicone resin composition is provided. It includes (A) an aromatic ring-containing hydrocarbon compound containing at least 2 silicon-bonded hydrogen atoms, in which the silicon atoms are bonded to the hydrocarbon skeleton; (B) an organopolysiloxane with a branched or three dimensional network structure, and with a viscosity at 25&#xb0; C. of at least 1,000 mPa&#xb7;s, having an average composition formula (1):RSiO&#x2003;&#x2003;(1)wherein, Rindependently represent a substituted or unsubstituted monovalent hydrocarbon group, a substituted or unsubstituted hydrocarbyloxy group, or a hydroxyl group, provided from 0.1 to 80 mol % of all the Rgroups are alkenyl groups, and x represents a positive number that satisfies 1&#x2266;x&#x3c;2; and (C) a hydrosilylation reaction catalyst. The composition yields a cured product that is transparent and displays excellent hardness and flexural strength.

Curable silicone resin composition

Provided is a curable silicone resin composition including (A) a siloxane/polycyclic hydrocarbon-based compound containing at least 2 silicon-bonded hydrogen atoms, which is an addition reaction product of (a) a siloxane-based compound with at least 3 silicon-bonded hydrogen atoms, and (b) a polycyclic hydrocarbon with at least 2 addition reactive carbon-carbon double bonds, (B) a siloxane-based compound containing at least 2 silicon-bonded alkenyl groups, and (C) a hydrosilylation reaction catalyst. This composition is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material.

Provided is a curable composition including (A) an addition reaction product of (a) a compound with 2 silicon atom-bonded hydrogen atoms within each molecule, having a general formula (1): wherein, A is a bivalent group represented by a formula (2): (wherein, R' represents an unsubstituted or substituted monovalent hydrocarbon group of 1 to 12 carbon atoms, or an alkoxy group of 1 to 6 carbon atoms, and n represents an integer from 0 to 100), or a group having a structural formula (3): and each R represents an unsubstituted or substituted monovalent hydrocarbon group of 1 to 12 carbon atoms, or an alkoxy group of 1 to 6 carbon atoms, and (b) a polycyclic hydrocarbon with 2 addition reactive carbon-carbon double bonds within each molecule, said addition reaction product containing at least two addition reactive carbon-carbon double bonds in each molecule, (B) a compound with at least 3 silicon atom-bonded hydrogen atoms within each molecule, and (C) a hydrosilylation reaction catalyst. This composition is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material.

Curable composition

A curable silicone resin composition is provided which is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material, and which produces a cured product having high hardness and strength and further having good optical transmission in the short wavelength region. The composition includes (A) an aromatic hydrocarbon compound having at least two hydrogen atoms bonded to silicon atoms with the silicon atoms being bonded to the hydrocarbon skeleton of the aromatic hydrocarbon compound, (B) a cyclic siloxane compound having at least two silicon atom-bonded alkenyl groups, and (C) a hydrosilylation reaction catalyst, or (D) an aromatic hydrocarbon compound having at least two alkenyl groups bonded to silicon atoms with the silicon atoms being bonded to the hydrocarbon skeleton of the aromatic hydrocarbon compound, (E) a cyclic siloxane compound having at least two silicon atom-bonded hydrogen atoms, and (C) a hydrosilylation reaction catalyst.

A method for forming a metal pattern by the micro-stamping process involves the steps of treating a substrate bearing a thin film of a reducing silicon polymer with a solution containing a salt of a metal having a standard oxidation-reduction potential of at least 0.54 volt, allowing metal colloid to deposit on the substrate surface, stamping a pattern of an alkane thiol to the substrate surface for transferring the pattern to the metal colloid-bearing silicon polymer thin film, and effecting electroless metal plating for forming a metal pattern only on the region of the silicon polymer thin film which is not covered with the alkane thiol pattern. The finely defined metal pattern can be formed on any type of substrate though inexpensive simple steps and has good adhesion to the substrate.

Metal pattern forming method

A crosslinkable silicon polymer composition is provided comprising (A) a silicon polymer containing Si--Si bonds and Si--H groups and having a Mn of 500-500,000, (B) a polyfunctional aromatic carboxylic acid allyl ester, and (C) an organic peroxide or azo compound. The composition cures into a crosslinked polysilane film which is solvent insoluble, tough, and abrasion resistant.

Crosslinkable silicon polymer compositions

A polysilane containing insoluble matter and microgel as impurities is purified by dissolving the polysilane in a good solvent to form a polysilane solution, adding a poor solvent to the polysilane solution for causing a minor amount of high molecular weight component to precipitate, thereby agglomerating the insoluble matter and microgel, and removing the resulting agglomerate by filtration. The purifying method of the invention can readily remove the insolubles from the starting polysilane within a short time. A pure polysilane which can form a transparent smooth film is obtainable with commercial advantages.

Purification of polysilane

A polysilane composition including a polysilane and a plasticizer can be coated as a thin film having improved mechanical strength and a high photo decomposition rate. A polysilane composition including a polysilane and an ester can be coated as a thin film which is exposed to UV and readily dyed to form a dyed polysilane film.

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Kawasaki, Japan

Eiichi Tabei