Hitachi Chemical Company, Ltd.

Eiichi Shinada

Shigeharu Arike

Yoshiyuki Tsuru

Katsuyuki Masuda

Kanji Murakami

Toshiro Okamura

Yorio Iwasaki

Masatoshi Yamaguchi

Yuichi Nakazato

Takehiro Fukuyama

Takayuki Suzuki

Takeshi Horiuchi

Yoshihiro Sakairi

Mitsuo Katayose

Kazunori Yamamoto

Masao Kanno

Masahiro Katou

Yuuichi Shimayama

Yasushi Ooyama

Yuuki Yanagita

Masashi Okoshi

Noriaki Watanabe

An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3):

Adhesive agent, adhesive material using the same, and method of use thereof

An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2):

Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the inner wall of the through hole. A first printed board () is provided with a wiring, which has a wiring section and a bump mounting pad (), and a substrate section. The method is provided with a step of forming a solder bump () on at least a bump mounting pad on the first printed board or a pad section of a second printed board () having the pad section () by using a solder paste, and a step of bonding the first printed board and the second printed board in layers by having an insulating adhesive () between the first printed board and the second printed board and electrically connecting the first printed board with the second printed board.

Method for manufacturing multilayer wiring board

An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.

Circuit boards using heat resistant resin for adhesive layers

A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.

Multiple wire printed circuit board and process for making the same

A heat resistant resin composition comprising (a) a polyamide-imide resin and (b) a thermosetting resin component, said composition giving a cured product having a storage elastic modulus at 300.degree. C. of 30 MPa or more, provides an adhesive sheet showing excellent solder heat resistance.

Heat resistant resin composition and adhesive sheet using the same

An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

Process for producing multiple wire wiring board

Multiple wire adhesive on a multiple wire wiring board

An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

Growing community of inventors

Ibaraki-ken, Japan

Eiichi Shinada