Fujitsu Optical Components Limited

Eiichi Kodera

Masaki Sugiyama

Norihisa Naganuma

Akira Ishii

Yoshinobu Kubota

A light communication device further includes a rigid substrate, a package, and a flexible substrate. The rigid substrate includes a first terminal arranged on a surface thereof and a second terminal having a first hole opened at the surface. The package includes a third terminal and a fourth terminal being provided on a side wall thereof and being electrically coupled to a signal electrode and a ground electrode of the signal processor, respectively. The flexible substrate includes a fifth terminal and a sixth terminal being electrically coupled to the third terminal and the fourth terminal, respectively. The fifth terminal is electrically coupled to the first terminal on the surface, and the sixth terminal, with being placed into the first hole, is electrically coupled to the second terminal.

Light communication device, light module, and method for coupling

An optical modulating apparatus includes driver that is mounted on a printed circuit board such that a signal electrode pad and a ground electrode pad of the driver are exposed in an opening of the printed circuit board. An optical modulating device is mounted on the printed circuit board, opposing the driver across the opening. A flexible circuit board is disposed in the opening. An end of a signal terminal of the flexible circuit board is electrically connected to a signal electrode of the optical modulating device. An end of a ground terminal of the flexible circuit board is electrically connected to a ground electrode of the optical modulating device. The other end of the signal terminal is soldered to the signal electrode pad of the driver, and the other end of the ground terminal is soldered to the ground electrode pad of the driver.

Optical modulating apparatus and optical transmitter

There is provided a communication device that includes a first circuit board which includes a first ground pattern (GND) and a first signal line formed on a substrate, a ground pin electrically coupled with the first GND, where the ground pin protrudes from an end of the substrate, and a signal pin formed in the substrate and electrically coupled with the first signal line, where the signal pin protrudes from the end. The communication device further includes a send circuit board which includes a second GND and a second signal line, wherein when an end of the circuit board is inserted into a space between the ground pin and the signal pin, the first signal line and the second signal line are electrically coupled with each other via the signal pin and the first GND and the second GND are electrically coupled with each other via the ground pin.

Growing community of inventors

Yokohama, Japan

Eiichi Kodera