Mitsubishi Chemical Industries Limited

Nippon Gohsei Kagaku Kogyo Kabushiki Kaisha

Eiichi Kamoshida

Masaaki Miyamoto

Hiroshi Takida

Mitsuhiko Tamura

Masaya Ueda

Disclosed herein is a polyamide resin composition comprising a polyamide resin, from 0.1 to 1% by weight of fine silica based on the polyamide resin and from 1 to 99% by weight of a silane coupling agent based on the fine silica. The packaging material obtained from the polyamide resin composition of the present invention has uniform and satisfactory transparency and is excellent in the blocking resistance.

Polyamide resin composition

A moldable resin composition comprising (1) a saponified ethylene/vinyl acetate copolymer having an ethylene content ranging from 20 to 80 mole % and a saponification degree of not less than 90%, and a polyamide resin containing terminal carboxyl (--COOH) and terminal amide (--CONRR') groups, wherein the number (A) of the terminal carboxyl groups and the number (B) of terminal amide groups satisfies the relationship: ##EQU1## wherein (R) is a hydrocarbyl group of 1 to 22 carbon atoms and R' is a hydrogen atom or a hydrocarbyl group of 1 to 22 carbon atoms.

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Fujisawa, Japan

Eiichi Kamoshida