Nitto-denko Corporation

Arakawa Chemical Industries, Ltd.

Eiichi Imoto

Yoshio Nakagawa

Chihiro Yoshida

Koki Hashimoto

Takashi Yamamoto

Katsuya Kume

Yasunori Yamamoto

Fumiteru Asai

Miho Yamaguchi

Izumi Ozeki

Tomohiro Omure

Kunio Nagasaki

Takeshi Igarashi

Kenichi Nishikawa

Kazuo Ouchi

Hirofumi Ebe

Kenichi Fujikawa

Shoichiro Saito

Makoto Fujihara

Toshinobu Hoshino

Tomokazu Takahashi

Yuta Shimazaki

Toshiaki Okuno

Hiroshi Matsuo

Takashi Habu

Masakazu Morimoto

Yoshinori Yoshida

Tadatoshi Nakanishi

Tomoya Matsuda

Hidenori Suzuki

Yuki Kato

Shota Tanaka

Toru Higashimoto

Akihiro Yamazaki

Katsuyuki Nakabayashi

Yuki Hashimoto

Keita Kume

Hirofumi Ono

Provided is a paint-protective coating material formed from an acrylic coating composition comprising an acrylic polymer as base polymer. The acrylic polymer-forming monomers includes a monomer (m) having a homopolymer Tg of 90° C. or higher and a monomer (m) having a homopolymer Tg of −30° C. or lower. The monomer (m) includes at least acrylonitrile. In the monomers, the monomers (m) and (m) have a molar ratio (m/m) of 0.8 or higher and 1.5 or lower. The paint-protective coating material has storage moduli of 150 MPa or higher and 1000 MPa or lower at 23° C., and 0.40 MPa or higher at 70° C.

Paint-protective coating material and acrylic coating composition

Provided is a paint-protective coating material formed from a liquid coating composition. The coating composition comprises, as its base polymer, a polymer (A) that is a polymerization product of monomers comprising an acrylic monomer. The paint-protective coating material has a storage modulus at 70° C. of 0.40 MPa or higher and 1.30 or lower, a storage modulus at 23° C. of 250 MPa or higher and 800 MPa or lower, and a storage modulus at −30° C. of 2300 MPa or less.

Paint-protective coating material and coating composition

A surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc is provided. The surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc., comprises a surface layer, a resin substrate layer and a PSA layer, and has a multilayer structure with the resin substrate layer placed between the surface layer and the PSA layer, wherein the surface layer is a layer obtainable by curing a heat-curable composition comprising the following components:

Pressure-sensitive adhesive sheet for surface protection

Provided is a method for producing a sintered body that forms a rare-earth permanent magnet, has a single sintered structure and an arbitrary shape, and has easy magnetization axis orientations of different directions applied to the magnet material particles in a plurality of arbitrary regions. This method forms a three-dimensional first molded article from a composite material formed by mixing a resin material and magnet material particles containing a rare-earth substance. The first molded article is then subjected to a deforming force and a second molded article is formed in which the orientation direction of the easy magnetization axis of the magnet material particles in at least the one section of the horizontal cross-section is changed to a direction which differs from the orientation direction of the first molded article. The second molded article is heated to a sintering temperature and kept at the temperature for a period of time.

Method for producing sintered body that forms rare-earth permanent magnet and has non-parallel easy magnetization axis orientation

[Problem] To provide an adhesive sheet having a surface sliding property and stainproof property. [Means for solving] An adhesive sheet is one that comprises at least a substrate and an adhesive layer, a static friction coefficient of the substrate is 0.05 or more and 1.50 or less, and an absolute value of a &#x394;L* value of the substrate is 0.01 or more and 45.00 or less. A load at a time of 5% elongation of the substrate is preferably 1 N/cm or more and 15 N/cm or less. And a stress relaxation rate of the substrate by elongating to 10%, stopping the elongation at that state and after lapsing 600 seconds is preferably 40% or more and 100% or less.

Adhesive sheet

[Problem] This is to provide an adhesive sheet having curved surface followability and chemical resistance. [Means for solving] The adhesive sheet is an adhesive sheet having at least a substrate and an adhesive layer, a load at the time of 5% elongation of the substrate is 15 N/cm or less, a stress relaxation rate of the substrate by elongating to 10%, stopping the elongation at that state and after lapsing 600 seconds is 40% or more and 100% or less, and a chemical weight increased ratio of the substrate is 60% or less.

Provided is a production method for a pressure-sensitive adhesive composition capable of sufficiently expressing each of 'attachment position correction workability' that enables a pressure-sensitive adhesive tape containing the composition to be easily aligned by the expression of good temporary attachment property, 'reworkability' that enables the tape to be easily reattached, and &#x201c;temperature-sensitive strong pressure-sensitive adhesiveness&#x201d; that enables the tape to express strong temperature-sensitive pressure-sensitive adhesiveness. The production method for a pressure-sensitive adhesive composition is a production method for a pressure-sensitive adhesive composition containing a cross-linked polymer in which an acrylic copolymer (A) is cross-linked by a polyurethane(meth)acrylate (B), the method including irradiating a monomer mixed liquid essentially containing a (meth)acrylate and a (meth)acrylamide with an active energy ray in the presence of the polyurethane(meth)acrylate (B).

Production method for pressure-sensitive adhesive composition

The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.

Pressure-sensitive adhesive sheet for protecting semiconductor wafer

Growing community of inventors

Ibaraki, Japan

Eiichi Imoto