Canon Kabushiki Kaisha

Eigo Kawakami

Kazuyuki Kasumi

Toshinobu Tokita

Hirohisa Ota

Takashi Nakamura

Hiroshi Matsuda

Kunihiro Sakai

Kunitaka Ozawa

Hisaaki Kawade

Shunichi Uzawa

Haruki Kawada

Hiroyasu Nose

Yoshihiro Yanagisawa

Yuko Morikawa

Minoru Yoshii

Toshimitsu Kawase

Tetsuya Kaneko

Shigeyuki Suda

Nobutoshi Mizusawa

Yukichi Niwa

Hideya Kumomi

Koji Uda

Hideki Ina

Yasuo Ogino

Mitsutoshi Ohwada

Masahiro Haruta

Shingo Okushima

Kenji Saitoh

Yukuo Nishimura

Ken Eguchi

Junichi Seki

Shinichi Hara

Noriyuki Nose

Akihiko Yamano

Hiroshi Takagi

Isamu Shimoda

Atsunori Terasaki

Nobuo Kushibiki

Takao Kariya

Takeshi Baba

Toshiyuki Nakajima

Mitsutoshi Kuno

Takashi Noma

Motoki Okinaka

Toshiaki Asano

Mitsunobu Nakazawa

Masakazu Matsugu

Ryuichi Ebinuma

Mitsuaki Amemiya

Kazuya Matsumoto

Hiroshi Kurosawa

Shigeru Terashima

Makiko Mori

Kazunori Iwamoto

Yuji Chiba

Hidehiko Fujioka

Hirohisa Ohta

Toshimitsu Kawasa

A transfer apparatus, for molding a resin on a substrate using a mold on which a pattern is formed and releasing the mold from the resin to transfer the pattern onto the substrate, includes a charge removing device configured to remove a charge of the mold, and a detector configured to detect an electric potential of the mold. The charge removing device is configured to remove the charge of the mold if the electric potential of the mold detected by the detector is not less than a predetermined value.

Transfer apparatus and method of manufacturing device

There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.

Imprinting apparatus and method therefor

An imprinting machine that brings a mold having a pattern into contact with an object and transfers the pattern onto the object includes a measurement unit that measures a position of the mold when the mold contacts the object.

Imprinting machine and device manufacturing method

An imprint apparatus includes: a support member which supports the mold; a substrate stage which supports the substrate; a detector which detects a force applied to the mold; a mechanism which forms a space for removing the mold supported by the support member, between the support member and the substrate stage, and a controller. The controller determines a release force required to detach the mold from the cured resin, based on a detection result from the detector, compares the determined release force with a first threshold value, and causes the mechanism to form the space if the determined release force is larger than the first threshold value.

Imprint apparatus and article manufacturing method

An imprint apparatus, which performs an imprint process for forming a pattern of a mold on a resin coated on a substrate, includes an imaging unit configured to image the resin on which the pattern is formed, and a controller configured to control the imprint process. When the pattern is continuously formed on the substrate, the controller compares an image of at least a partial area imaged by the imaging unit and an image of a reference state, which is obtained in advance, and when patterns each having a difference, which falls outside an allowable range, between the images are continuously formed, it determines a transfer error.

Imprint apparatus and method of manufacturing article

A pattern transferring apparatus is disclosed which can prevent damage to a transferred pattern and realize fast mold release regardless of the type of resist. The pattern transferring apparatus transfers a pattern formed on a mold to an object by bringing the mold into contact with the apparatus has a deformer which causes deformation in the mold for releasing the mold from the object. The apparatus transfers a pattern formed on a mold to a photo-curing resin by bringing the mold into contact with the photo-curing resin and applying light thereto to cure the photo-curing resin. The apparatus has an optical system which applies light at an irradiation light intensity to a non-transfer area other than a transfer area where the pattern is to be transferred in the photo-curing resin, the intensity being different from an irradiation light intensity of light applied to the transfer area.

Pattern transferring apparatus and pattern transferring method

An imprint apparatus molds resin dispensed on a shot region of a substrate with a mold and forms a pattern of resin on the shot region. The apparatus includes a mold stage configured to hold the mold, a substrate stage configured to hold the substrate, a drive mechanism configured to change a relative positional relationship between the mold stage and the substrate stage in an X-Y plane that defines a coordinate of the shot region and a Z-axis direction perpendicular to the X-Y plane, and a controller. The controller is configured to control the drive mechanism so that the mold and the shot region perform relative vibration, in the X-Y plane, with respect to a relative position where the mold and the shot region align, and a distance between the mold and the shot region decreases in the Z-axis direction in parallel with the vibration, and the resin is molded by the mold.

An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.

A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, includes a supplier for supplying the resist between the substrate and the mold, and a recovery unit for recovering the resist.

Processing apparatus

A processing method for transferring a relief pattern of a mold to a resist includes the steps of compressing the mold having the relief pattern against the resist on a substrate, irradiating an exposure light onto the resist through the mold, vibrating the mold and the substrate relative to each other during the irradiating step, and releasing the mold from the resist.

Processing apparatus and method

A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, includes a supplier for supplying the resist between the substrate and the mold, and an illumination optical system for illuminating ultraviolet light onto the resist via the mold so as to cure the resist.

A processing method for forming a first pattern on a substrate to which a resist is applied includes the steps of pressing an original having a second pattern that has a relief reverse to that of the first pattern, against the resist on the substrate, and irradiating light onto the resist via the original, wherein a size of a concave of the second pattern is greater than a size of a convex of the first pattern corresponding to the concave of the second pattern, and a size of a convex of the second pattern is smaller than a size of a concave of the first pattern corresponding to the convex of the second pattern.

Processing method

A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, and an irradiation of light for exposing the resist onto the resist includes a mold chuck for holding the mold and for compressing the mold against the resist, and a deformation reducing part for reducing a deformation of the mold when the mold chuck applies a compression force to the mold.

Growing community of inventors

Utsunomiya, Japan

Eigo Kawakami