Tdk Corporation

Tdk Korea Corporation

Eietsu Abe

Takashi Kudo

Makoto Morita

Toru Tonogai

Kyohei Tonoyama

Toshiyuki Anbo

Yuichi Oyanagi

Fuyuki Miura

Kyosuke Inui

Hiroyuki Iwata

Kiyofumi Fujiwara

Sepung Ki

Chihu An

Masanori Sugai

An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.

Electronic component

The present invention provides a coil device which includes two coil elements in the same device and achieves an improved wire occupancy. The coil device includes a core including a winding core, and a winding wire part of which a first wire and a second wire are wound in a plurality of layers around the winding core, wherein the winding wire part includes a first part in which the first wire and the second wire of a same turn are wound adjacent to each other on a same layer, and a second part in which the first wire and the second wire of a same turn are wound in different layers without being adjacent to each other.

Coil device

Growing community of inventors

Tokyo, Japan

Eietsu Abe