Meta Platforms Technologies, LLC

Ehsan Vadiee

Andrew John Ouderkirk

Tingling Rao

Arman Boromand

Lafe Joseph Purvis, Ii

Kimberly Kay Childress

Namseok Park

Tanya Malhotra

Christopher Yuan Ting Liao

Renate Eva Klementine Landig

Jonathan Robert Peterson

Maik Andre Scheller

John Goward

Anurag Tyagi

Poer Sung

A photonic integrated circuit (PIC) includes an organic solid crystal (OSC) material layer, the OSC material layer having a substrate portion and a raised optical element integral with and extending from the substrate portion. The raised optical element may include a passive or active component of the photonic integrated circuit.

Active modulation of the refractive index in photonic integrated circuits via charge injection

An optical element includes a substrate and a metasurface located over a surface of the substrate. The metasurface may include an organic solid crystal material. A related display includes a waveguide, and a light input coupling element disposed on a surface of the waveguide, where the light input coupling element includes an organic solid crystal metasurface.

OSC metasurfaces

An organic thin film includes an organic crystalline phase, where the organic crystalline phase defines a surface having a surface roughness (R) of less than approximately 10 micrometers over an area of at least approximately 1 cm. The organic thin film may be manufactured from an organic precursor and a non-volatile medium material that is configured to mediate the surface roughness of the organic crystalline phase during crystal nucleation and growth. The thin film may be formed using a suitably shaped mold, for example, and the non-volatile medium material may be disposed between a layer of the organic precursor and the mold during processing.

High refractive index organic solid crystal with controlled surface roughness

A method of forming a high voltage optical transformer includes forming a via through a transparent carrier wafer, forming a conductive layer within the via, bonding a solid state lighting (SSL) package to a first side of the carrier wafer, and bonding a photovoltaic (PV) wafer to a second side of the carrier wafer opposite to the first side. The photovoltaic wafer may include an active area and a conductive area located outside of the active area that is in electrical contact with the conductive layer. The method further includes forming both an SSL contact with the solid state lighting package and a PV contact with the conductive layer on the same side of the carrier wafer.

Wafer-level 3D integration of high voltage optical transformer

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Redmond, WA, United States of America

Ehsan Vadiee