Sun Microsystems, Inc.

Ehsan Ettehadieh

Daniel Bernard Hruska

Naum Reznikov

Anthony N Eberhardt

Michael F McCormick, Jr

Howard Lee Davidson

Deviprasad Malladi

Nagaraj P Mitty

Erich H Selna

Hassan Siahpolo

Mario J Lee

Mark Hong Chen

Eric R Eberhardt

Sunil Kaul

Dev Malladi

John Schulte

James LaGassa

A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer or the like has internal parallel sides formed with horizontal guides to receive the bracket, a substantially open front face and an internal connector engageable with a mating connector on the rear of the drive when the bracket is fully inserted in the chassis. The sides of the bracket have features to protect the drive from horizontal and vertical vibrations. A handle is pivoted to the crosspiece near one end moveable between at least three positions: a first or latched position parallel to the crosspiece, a second position swinging out at about a 15&deg; angle and a third position at about a 45&deg; angle. In second position a first point on the end of the handle engages the front edge of the side and a second point is about to enter a slot in one side of the chassis. As the handle is pivoted toward third position the second point engages a margin of the slot and pulls the two connectors apart. To reinsert the drive, the positions of the handle are reversed. A spring biased latch engages a hook on the handle. A second spring opens the unlatched handle from the first to second positions.

Disk drive bracket

The present invention is a method and apparatus for unidirectional coolant flow control unit for pressurized cooling systems. The invention comprises a valve on a coolant flow control unit. The valve remains in the open position during normal function of the coolant flow control unit. If the coolant flow control unit fails, the valve closes. Thus, the cooling system performs better than prior art cooling systems in the event of a failure of one or more coolant flow control units. In one embodiment, multiple improved coolant flow control units can be implemented wherein a flow of coolant enters one side of the system and exits the other side. In the even of a failure, the closure of the valve is caused by the shifting pressure within the system, which forestalls the cooling problems associated with prior art redundant coolant control flow systems.

Method and apparatus for undirectional coolant flow control unit for pressurized cooling systems

A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer or the like has internal parallel sides formed with horizontal guides to receive the bracket, a substantially open front face and an internal connector engageable with a mating connector on the rear of the drive when the bracket is fully inserted in the chassis. The sides of the bracket have features to protect the drive from horizontal and vertical vibrations. A handle is pivoted to the crosspiece near one end moveable between at least three positions: a first or latched position parallel to the crosspiece, a second position swinging out at about a 15&deg; angle and a third position at about a 45&deg; angle. In second position a first point on the end of the handle engages the front edge of the side and a second point is about to enter a slot in one side of the chassis. As the handle is pivoted toward third position the second point engages a margin of the slot and pulls the two connectors apart. To reinsert the drive, the positions of the handle are reversed. A spring biased latch engages a hook on handle. A second spring opens the unlatched handle from the first to second positions.

A thermal conducting material for providing lateral thermal conduction across a surface of an integrated circuit and for enhancing thermal dissipation from the integrated circuit. The integrated circuit is incorporated within a semiconductor device having a cavity package. A layer of the thermal conducting material, preferably electrically non-conductive, is disposed on a surface of an integrated circuit in the form of a die to provide lateral heat conduction to reduce the number of hot spots within the integrated circuit. Alternatively, the thermal conducting, electrically non-conductive material may be used to fill a cavity within the cavity package so that the cavity package dissipates heat in a more effective manner.

Thermal management enhancements for cavity packages

A bracket having two parallel sides and an interconnecting crosspiece is attached to a disk drive or similar peripheral with the sides of the bracket extending longitudinally of the sides of the drive and the crosspiece extending across the front of the drive. A chassis of a computer or the like has internal parallel sides formed with horizontal guides to receive the bracket, a substantially open front face and an internal connector engageable with a mating connector on the rear of the drive when the bracket is fully inserted in the chassis. The sides of the bracket have features to protect the drive from horizontal and vertical vibrations. A handle is pivoted to the crosspiece near one end moveable between at least three positions: a first or latched position parallel to the crosspiece, a second position swinging out at about a 15.degree. angle and a third position at about a 45.degree. angle. In second position a first point on the end of the handle engages the front edge of the side and a second point is about to enter a slot in one side of the chassis. As the handle is pivoted toward third position the second point engages a margin of the slot and pulls the two connectors apart. To reinsert the drive, the positions of the handle are reversed. A spring biased latch engages a hook on handle. A second spring opens the unlatched handle from the first to second positions.

An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly process of this invention includes the steps of initially attaching a temporary heat slug to the back side of a package body, to which one or more semiconductor die are attached. The semiconductor die are then electrically connected to the package body and encapsulated to maintain fixed positions within the package cavity. The temporary heat slug is then moved and a final heat slug is attached to the package body and the back side of the one or more semiconductor dies utilizing a single layer of high conductivity adhesive. The package is compact, has reduced complexity, and is inexpensive to manufacture.

Integrated circuit package and method

An integral heat pipe, heat exchanger, and clamping plate. A base plate functioning as an evaporator has disposed in it a multiplicity of intersecting parallel and perpendicular internal channels extending laterally substantially across the base plate. A sintered copper thermal wick is applied to all channels. Thin-walled condenser tubes forming a condenser region are joined to the base plate at intersections of width wise and cross wise channels contained in the base plate. A multiplicity of fins extend to all condenser tubes. For heat pipe arrangements operating in horizontal configurations, all wick-lined channels within the base plate remain open. For heat pipe arrangements intended to operate in oblique or vertical configurations, horizontally extending channels vertically displaced relative to other horizontal channels are isolated from the latter by a multiplicity of plugs. The vertically isolated horizontally extending channels constrain the working fluid and its vapor to remain within a single horizontal channel and yet disperse laterally within the maximum internal dimensions of the evaporator. Condensed working fluid returning from the condenser region to the base plate and subsequently to the heated region via capillary action is cycled more rapidly through the evaporation and condensation phases, thereby increasing the efficiency of the integral heat pipe arrangement.

Integral heat pipe, heat exchanger and clamping plate

An apparatus providing a heat sink and protective cover for a Tape Automated Bonding ('TAB') integrated circuit mounted on a printed circuit board. The apparatus is comprised of a printed circuit board with a plurality of thermal vias drilled through it. The TAB integrated circuit is mounted on the printed circuit board over the thermal vias. The vias draw then heat generated by the TAB integrated circuit to the other side of the printed circuit board. A heat sink is then placed over the thermal vias on the opposite side of the board to dissipate the heat. The heat sink is held in place by a spring clip which hooks onto a molded plastic cover placed over the TAB integrated circuit. The apparatus is easy to manufacture and efficiently dissipates the heat generated by TAB integrated circuits.

Heat sink and cover for tab integrated circuits

Integral heat pipe, heat exchanger, and clamping plate

An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evaporator chamber and condenser assembly is attached to the multi-chip module and wick assembly. A suitable working fluid is introduced into the vapor chamber and the vapor chamber hermetically sealed. Application of the thermal wick to the heat producing multi-chip module eliminates the thermal impedance contributed by thermal transmission media used in prior art heat pipe assemblies, permitting a doubling of heat flux from the multi-chip module to the heat pipe evaporator.

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Albany, CA, United States of America

Ehsan Ettehadieh