Hewlett-packard Development Company, L.p.

Egons Dunens

Wade David Vinson

Rich Bargerhuff

The present invention relates to a housing assembly for computer hardware and includes side wall panels that define an outer casing that has an air inlet and outlet. The housing assembly also includes a fan and operation of the fan causes streams of air to enter and exit from the inlet and outlet and air to be conveyed within the outer casing to which heat from the computer hardware can be transferred. The housing assembly also includes a noise reduction assembly that includes a tortuous passageway through which air passing through the inlet and/or outlet passes. The tortuous passageway is configured such that sound that is emitted from the fan and enters into the tortuous passageway is dissipated therein so as to minimize the level of sound emanating from the passageway.

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Spring, TX, United States of America

Egons Dunens