Abb Schweiz Ag

Egon Herr

Stefan Kaufmann

Thomas Lang

Jerôme Assal

Mauro Nicola

Soto Gekenidis

The pressure contact spring () according to the invention comprises two contacting regions () for contacting metallized contact pads (), one contacting region comprising a contact tip (). Arranged between the contacting regions is a compressing region (). The contact tip is rounded with an outer radius. The rounded contact tip penetrates only little into the metallization of the contact pad even under high spring force.

Pressure contract spring for contact arrangement in power semiconductor module

The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.

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Zurich, Switzerland

Egon Herr