International Business Machines Corporation

Egidio E Marotta

Michael J Ellsworth, Jr

Prabjit Singh

Richard C Chu

Alfred Grill

Vishnubhai Vitthalbhai Patel

Bernard S Meyerson

Nanik Bakhru

Roger R Schmidt

Budy D Notohardjono

John Acocella

Gregory Scott Hopper

A method of fabricating a heat sink includes preparing a surface of a graphite-based substrate and removing particulate matter generated from the preparation of the surface of the substrate. A metal-based coating is applied at the surface of the prepared substrate. The prepared substrate having the metal-based coating is arranged to form a heat sink structure.

Method for manufacturing graphite-base heat sinks

A method of manufacturing a finned heat sink included obtaining a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material. A fin cover is secured to the fin core using one of heat and pressure to define a heat sink fin, wherein the fin cover is constructed of a foil material.

Method of manufacturing a finned heat sink

A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.

Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component

A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil material and is disposed relative to the fin core so as to envelope the fin core and a heat sink base, wherein the heat sink base is disposed so as to be in thermal communication with the plurality of heat sink fins.

Finned heat sink

One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint at the metal-based coating and the groove. Another exemplary embodiment of a heat sink comprises a plurality of fins alternatingly arranged with a plurality of spacers. A method of fabricating a heat sink comprises preparing a surface of a graphite-based substrate, removing particulate matter generated from the preparation of the surface of the substrate, applying a metal-based coating at the surface of the substrate, and arranging the substrate to form a heat sink structure. An apparatus for cladding fins of a heat sink with a protective material comprises a first chamber that facilitates the preparation of substrate surfaces, a grit-removing apparatus disposed adjacent to the first chamber, a second chamber that facilitates the application of the protective material to the substrate surfaces, and a transport device configured to facilitate the movement of the substrates through the first chamber, to the grit-removing apparatus, and through the second chamber.

Graphite-based heat sinks and method and apparatus for the manufacture thereof

A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.

Foil heat sink and a method for fabricating same

The present invention relates generally to a new erosion/corrosion resistant diaphragm, and more particularly to an erosion/corrosion resistant diaphragm that can be used in an apparatus for cooling integrated circuit chips. An erosion/corrosion resistant coating can be provided on one side of a metallic foil that will be exposed to fluid impingement. And, a similar erosion/corrosion resistant coating can be provided on the opposite side of the metallic foil where the normal thermal cycling of the chip might damage the unprotected metallic foil.

Erosion/corrosion resistant diaphragm

A device that contains a copper substrate; a rigidizing layer and/or a metal layer, and a non-graphitic hard carbon layer deposited on the rigidizing layer; and use as a heat sink or piston for electronic components.

Growing community of inventors

College Station, TX, United States of America

Egidio E Marotta