Leybold Aktiengesellschaft

Singulus Technologies Ag

Singulus Technologies Gmbh

Eggo Sichmann

Thomas Krug

Reinhard Gerigk

Wolf-Eckart Fritsche

Stefan Kempf

Wolfgang Becker

Michael Muecke

Wolfgang Buschbeck

Reiner Kukla

Friedrich Anderle

Dan L Costescu

Albert Feuerstein

Jurgen Meinel

Michaell Muecke

Edgar Rueth

Martin Pollmann

Jim Schlussler

Klaus Truckenmueller

Stephan Kempf

The invention relates to a method and a device for regulating the thickness of coatings or layers, in particular of bond coatings, wherein bonding is controlled in a programmed manner thereby taking into account the influence of disturbance variables. The invention can be used especially in the production of DVDs. The advantages of the present invention are reproducible accuracy in adjusting the thickness of the coating/bond coating and thus an increased production output.

Method and device for controlling thickness during spin coating

A method of coating a substrate by magnetron cathode sputtering includes a sputtering cathode having pole shoes and being arranged in a vacuum chamber. A target and a magnetic field are provided in an area of the surface of the target and the magnetic field is varied stepwise and/or continuously to displace the plasma radially such that the erosion groove is likewise displaced radially. The variable magnetic field is generated by coils between the back surface of the target and a yoke plate while a static magnetic field is gernated by an annularly arranged magnet in the area of the yoke plate and a target space between the target and the substrate is shielded by means of an iron core which also increases the field strength of the variable magnetic field.

Magnetron sputtering cathode with magnet disposed between two yoke plates

The present invention relates to a device for cathode sputtering for producing coatings on a substrate by means of a sputtering cathode, which can be arranged in a vacuum chamber and comprises pole shoes, a target and at least one magnet or ring magnet arranged concentrically with respect to the center axis of the sputtering cathode, wherein a divided yoke is arranged axially symmetrically with respect to the center axis of the sputtering cathode.

A method of preventing bubbles or small bubbles when connecting substrate parts of optical data carriers by means of an adhesive. At least one of the substrate parts and/or the adhesive is provided with electric charges.

Method for preventing bubbles or small bubbles when connecting substrate parts of optical data carriers by means of an adhesive

Cathodic sputtering device

Apparatus 1 for gripping, holding and/or transporting substrates 2, components of which are an entry station 3 and several processing station 4 to 9 arranged in series or in a circle for receiving the substrate 2, to which the substrate 2 is passed on by means of a transporting device 1 disposed on gripper arms 13 and having gripper elements 24, or a turntable 12, and subsequently is deposited in one or several deposit stations 14, wherein several gripper arms 13 can be shifted in the horizontal and/or vertical direction by means of the turntable 12. Some of the gripper elements 24 can be shifted together in the horizontal or vertical direction by means of the turntable 12 and at least one gripper arm 13' can be shifted in at least one of the movement directions independently of the remaining gripper arms 13.

Device for gripping, holdings and/or transporting substrates

A device for cathode sputtering for producing coatings on a substrate 27 by means of a sputtering cathode, which device can be introduced into a vacuum chamber and has magnets or ring magnets 9, 13 concentrically arranged in respect to the center axis 44 of the sputtering cathode, pole shoes 14 and a target 8. The target has a front surface 41 with at least a surface portion which is inclined with respect to the back surface 40 of the target. In the area of the back surface 40 of the target at least one second, outer ring magnet 42 with a larger diameter is provided in addition to the inner ring magnets 9, 13.

Device for cathode sputtering

Apparatus for surface coating or for lacquering of a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate support 14 and can be driven or made to perform a rotating movement, wherein the medium to be applied or the lacquer fluid is applied to the substrate 2 via a feed device 6 which can be displaced in relation to the substrate 2 and/or can be driven. The substrate 2 or the substrate support 14 can be displaced by means of a guide device or in a connecting link guide 7 in such a way that in the area of the substrate 2 the feed device 6 for applying the fluid or the lacquer is conducted approximately parallel with the surface of the substrate 2 and can be stopped at any arbitrary point above the substrate 2 at an even height distance.

Device for surface coating or lacquering of substrates

An apparatus for surface coating or for lacquering a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate carrier 14 and can be driven or given a rotating movement by means of a drive device, wherein the material or the lacquer fluid 5 to be applied is placed on the substrate 2 from a feed device 6. The fluid medium or the lacquer 4 released by the substrate support 14 is delivered at least to a first collecting reservoir 17 which is connected with at least one filter 28, from where the fluid is indirectly or directly conducted via a pump 29 to the first collecting reservoir 27, wherein an underpressure can be set between a first flow-off line 33 of the first collecting reservoir 27 and the pump 29.

In an apparatus for the transfer of substrates (9) from an initial station (3) through several process stations (4 to 8) and back to this initial station (3), manipulators (10 to 14) having pivoting gripper arms (15 to 19) and carousel transfer systems (20,21) for the transfer of the substrates (9) are provided. One of the carousels (20) provided with substrate holders (22) cooperates both with a two-armed first manipulator (11) and with a two-armed second manipulator (10). The second manipulator (10) lifts several substrates (9) simultaneously from the first carousel (20) in one period of time and feeds them to the corresponding second process station (5) which is configured for the simultaneous processing of several substrates. The second manipulator (11), in the same period of time, lifts one substrate (9) at a time from the first carousel (20) in several swings of its two gripper arms (16,16') and feeds them to the first process station (4) for the processing of one substrate at a time and carries them back from this process station (4) onto the first carousel (20). Two injection molding machines can be associated with the first carousel (20) and can feed the substrates directly through an additional manipulator.

Apparatus for the transfer of substrates

A DC source 10 connected to an electrode 5 is disposed in a coating chamber which can be evacuated. The electrode is electrically connected to a target 3 which is sputtered and the sputtered particles are deposited on the substrate, while a process gas is introduced in the coating chamber 15, 15a. The target is made of an aluminum-silicon alloy which may contain 0.5 to 2.0 percent silicon and 99.5 to 98.0 percent aluminum in order to improve the adhesive strength and the service life of the layer 2. The substrate may be made of polycarbonate.

Process for coating a polycarbonate substrate with an aluminum-silicon

A target has a front sputtering surface including an inner annular surface and an outer frustoconical surface which are concentric to an axis and adjoin at an angle to form a break. A ring of magnets and a first ring-like pole shoe outside the target, together with a second pole shoe inside the target and a yoke facing the back of the target, provide lines of flux through the target and arcuately over the front surface to form a first plasma ring over the break and a second plasma ring radially outside the break.

Apparatus for cathode sputtering

The invention relates to a sputtering cathode for coating substrates in cathode sputtering apparatus, with a cathode base body 5, a target of nonmagnetic material disposed thereon and having at least one flat sputtering surface 9a, a magnet system 7 with pole faces 7c, 7d, of opposite polarity lying on both sides of the target margins for the production of a closed tunnel of magnetic lines of force overarching the sputtering surface 9a, while the pole shoes 23, 24, surrounding the target reach at least to the outer boundary of the target 9 or partially overlap the latter.

Sputtering cathode

A crucible (9) of a nonmetallic material with an elongated cavity (42) to contain the material to be evaporated has on top a vapor emission slot (45) which is defined at its longitudinal edges (43, 44) by two elongated plates (40, 41) of a likewise nonmetallic material. In the cavity (42) two heating rods (46, 47) are disposed in a mirror-symmetrical relationship to a plane of symmetry (S) through the vapor emission slot (45), one under each of the plates (40, 41) defining the vapor emission slot (45). Additional heating means are provided outside of the crucible and inside of a thermal barrier system.

Linear thermal evaporator for vacuum vapor depositing apparatus

Cathode base (1) has a hollow target (8) disposed thereon with at least one planar sputtering surface (8a), of circular shape for example, which is encompassed by at least two concentric, continuous projections (8b, 8c), and with a magnet system (6) with pole faces (6c, 6d) of opposite polarity lying on both sides of the target (8) for the production of magnetic lines of force (11, 11', . . . ) running substantially parallel to the sputtering surface (16a), the wall surfaces (8d, 8e) of the projections (8b, 8c) of the target (8), adjoining the sputtering surface (8a) being disposed at an angle (.alpha.) to the perpendicular, is preferably in a range between 30 and 70 degrees.

Growing community of inventors

Gelnhausen, Germany

Eggo Sichmann