Amkor Technology, Inc.

Eelco Bergman

Sean Timothy Crowley

Bradley D Boland

William M Anderson

A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces.

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Sunnyvale, CA, United States of America

Eelco Bergman