Agency for Science, Technology and Research

Georgia Tech Research Corporation

National University of Singapore

Illinois Tool Works Inc.

Ee Hua Wong

Ranjan Rajoo

Ranjan S/o Rajoo

Mahadevan Krishna Iyer

Wai Kwan Wong

Kuo Tsing Tsai

Kah Woon Seah

Poi Siong Teo

A micro-impact testing apparatus for measuring the impact characteristics of a microelectronics specimen exposed to an impact thereon. The apparatus comprises of a specimen holder for receiving a specimen to be tested, and an impact device. The impact device comprises of an impact head, a support member, at least one connecting element and a first flexural spring. The support member is connected to the connecting element in that the first flexural spring is firmly attached with its one end to the support member and with its other end to the connecting element. A second flexural spring, being at least substantially identical to said first flexural spring, is firmly attached with its one end to the connecting element and with its other end to the impact head so that the ends of the first and second flexural springs define, in an unloaded state of the flexural springs, a rectangle. The impact head is moveable transversally with respect to the first and second flexural springs along a linear line between a spring-loaded position and an impact position thereof. The specimen holder is aligned with the impact device such that the specimen is arranged in said impact position of the impact head so that the impact head is capable of impacting on the specimen after traveling from its loaded position towards its impact position along said linear line upon release thereof from said loaded position.

Micro-impact testing apparatus

A bend testing apparatus for simulating free vibrational flexing at high speeds and frequencies in a test specimen, said apparatus comprising a cam having a narrow circumferential profile or linear profile wherein at least one portion of the profile of said cam comprises at least one waveform, a specimen holder that holds the test specimen on opposite ends of the test specimen in a default position, a light-weight deformation member operable to deflect at least one point on the test specimen from the default position, a follower with one end in operable contact with the cam and its other end connected to the deformation member, such that a displacement of the follower is according to the profile of the cam, to actuate the deformation member correspondingly and to deflect the at least one point on the test specimen from said default position upon movement of the cam.

Bend testing apparatus and method of carrying out the same

A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.

Method and device to elongate a solder joint

We disclose a technique to generate stretched solder columns (bumps) at the wafer level, suitable for wafer level packaging. This is accomplished through use of using two wafers&#x2014;the standard (functional) wafer that contains the integrated circuits and a master (dummy) wafer on whose surface is provided an array of solder bumps that is the mirror image of that on the functional wafer. After suitable alignment, both sets of solder bumps are melted and then slowly brought together till they merge. Then, as they cool, they are slowly pulled apart thereby stretching the merged solder columns. Once the latter have fully solidified, they are separated from the master wafer only.

Wafer level super stretch solder

Growing community of inventors

Singapore, Singapore

Ee Hua Wong