Samtec Incorporated

Edwin Loy

R Brad Bettman

Eric Jean Zbinden

Jignesh H Shah

Chadrick Paul Faith

Keith R Guetig

Jean Karlo Williams Barnett

Yan Yang Zhao

Liam P Parkes

Chihhao Chen

Arlon Martin

Matthew Brian Puffer

Raymond Lee

Dyan Seville-jones

Stephen Michael Girlando

Christopher Alan Bandfield

This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.

Sealed optical transceiver

A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.

Wirebondable interposer for flip chip packaged integrated circuit die

Interconnect systems having anti-backout latches and securement members are disclosed.

Interconnect system having retention features

Growing community of inventors

Freemont, CA, United States of America

Edwin Loy