Motorola Solutions, Inc.

Edwin L Bradley

Peter B Gilmore

Charles E Kline

David J Meyer

Anthony J Suppelsa

A device is provided that includes: a substrate including dielectric material and a conductive via extending into the substrate from a surface of the substrate. The device further includes a conductive pad positioned at the surface of the substrate and offset in a plane of the surface from the conductive via, the conductive pad to receive a solder joint connection to an electronic component. The conductive pad includes a concave edge that defines a gap with a convex edge of the conductive via.

Solder pads with concave edges for ball grid arrays

A method for managing power of a power source and a system is disclosed. The method includes determining () a power source capacity value for the power source having a plurality of cells. Further, the method includes determining () a cell-capacity value for each cell of the plurality of cells. Furthermore, the method includes determining () a duty-cycle ratio value for each cell of the plurality of cells according to the determined cell-capacity value of the cell and the power source capacity value. Moreover, the method includes drawing () power from each cell of the plurality of cells according to the determined duty-cycle ratio value of the cell to achieve the power source capacity value for the power source.

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Chicago, IL, United States of America

Edwin L Bradley