U.S. Monolithics, L.l.c.

Motorola Corporation

Edwin Jack Stanfield

Kenneth V Buer

Dean Lawrence Cook

Richard Scott Torkington

Michael R Lyons

John Martin Peitz

Phillip James Denisuk

A system and method for high power block upconversion having a stand-alone and surface-mountable component is provided. The HP-BUC system of the invention provides a 'drop-in' component capable of mixing a local oscillator signal with an IF signal to produce an RF signal in the millimeter-wave and higher bands. In addition, the HP-BUC provides filtering of unwanted spurious signals and requires no further signal amplification prior to transmission, for example in a satellite communications system.

High power block upconverter

A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.

Modular high power solid state amplifier

A power amplifier uses a plurality of solid-state amplifiers (FIGS. 2 and 3, 140) arranged in a parallel manner to form a power amplifier module (10). Each solid-state amplifier is adhered to a low thermal expansion insert (130). The insert is then coupled to a low cost aluminum substrate in order to carry the excess heat from each solid-state amplifier (140) to the aluminum housing. The power outputs from the solid-state amplifiers from each module are combined with the power outputs from other modules using electroformed waveguide combiners (FIG. 1, 30, 40).

Efficient solid-state high frequency power amplifier structure

Growing community of inventors

Queen Creek, AZ, United States of America

Edwin Jack Stanfield