Compuadd, Corporation

Dell Products Inc.

Edwin C Tinsley, Jr

James H Quiggins

Wallace Huson Ables

Philip Conde

Subramanian Vasudevan

Edward Rhem

Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.

Printed circuit board assembly process using multiple solders and assembled boards made using the same

Personal computer housing

Computer housing front panel

Growing community of inventors

Austin, TX, United States of America

Edwin C Tinsley, Jr