E.i. Dupont De Nemours and Company

Other

Edward William Tokarsky

Vlodek Gabara

William Cheng Uy

Theodore Augur Koch

John J McEvoy

Che-Hsiung Hsu

Robert Thomas Young

The processes and apparatus of the present invention concerns melt spinning high viscosity fluoropolymers into single filaments or multi-filament yarns at high spinning speeds, the melt spinning being carried out at a temperature which is at least 90&#xb0; C. greater than the melting point of the polymer or in the case of perfluoropolymer, at a temperature of at least 450&#xb0; C., and the yarns produced by the process, wherein the filaments can exhibit an orientation at the surface of the filament no greater than at the core of the filament.

High speed melt spinning of fluoropolymer fibers

The processes and apparatus of the present invention concerns melt spinning high viscosity fluoropolymers into single filaments or multi-filament yams at high spinning speeds, the melt spinning being carried out at a temperature which is at least 90&deg; C. greater than the melting point of the polymer or in the case of perfluoropolymer, at a temperature of at least 450&deg; C., and the yams produced by the process, wherein the filaments can exhibit an orientation at the surface of the filament no greater than at the core of the filament.

A catalyst composition is disclosed which includes a p-aramid polymer supporting a catalyst agent. The composition exhibits improved catalytic activity when compared with a similar composition using m-aramid polymer as the support. The composition contemplates shaped and formed catalyst structures using p-aramid particles and fibers, as papers and fabrics, and as, for example, honeycomb and mats.

Aramid polymer catalyst supports

A shielded cable is disclosed having metal coated aramid fibers as the shielding.

Shielded cable

A process is disclosed for making metal plated PPD-T fibers wherein the plating is durable and highly conductive. The process involves contacting the fibers with an 80 to 90% sulfuric acid solution, neutralizing and washing the fibers with water, and then plating the fibers by an electroless plating process. The acid treatment of the fibers promotes adhesion between the metal and the fiber and high electrical conductivity for the plated metal.

Electroless plated aramid surfaces and a process for making such surfaces

High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.

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Newark, DE, United States of America

Edward William Tokarsky