Intel Corporation

Other

Edward W Jaeck

Chia-Pin Chiu

Robert M Nickerson

Lesley A Polka

Geoffery L Reid

Ronald I Spreitzer

Geoffery Reid

An electronic package of the kind having a folded substrate is provided. The substrate is configured so that a stress concentration is created where folding is desired. In the present example, the stress concentration is created with first a resilient metal ground layer that resists bending and has an edge that promotes the creation of a stress concentration in a flexible layer at or near the edge. A second metal ground layer resists bending in another portion of the substrate, and also has an edge creating a stress concentration in a different area of the flexible layer. The portions of the substrate having the first and second resilient metal ground layers can be folded over one another with substantially no bending in these portions, while a fold portion between the edges bends to allow for folding of the substrate.

Electronic package having a folded package substrate

A reconfigurable truck bed has a plurality of receivers. A variety of accessories have structure that mates with the receivers in order to support the accessories on the truck bed. The accessories may be selectively positioned in a particular receiver or set of receivers. The accessories may also be conveniently oriented or reoriented for a particular circumstance or use. As such, the truck bed may be selectively reconfigured to meet the needs of a user and provide a particular benefit. In another aspect, a body structure or a chassis structure of any motor vehicle may be provided with receivers. Frames providing the receivers may be added onto bodies or chassis of any motor vehicle.

Reconfigurable truck bed or vehicle body

An apparatus including a substrate having dimensions suitable as a support circuit for at least one integrated circuit, the substrate comprising a laterally extending plication region defining first and second longitudinal portions; a plurality of conductive traces distributed in a first distribution plane of the substrate and extending transversely through the plication region; a first and second layers of conductive material in a second distribution plane of the first portion and second portion, respectively, of the substrate; at least one conductive bridge extending transversely through less than the entire plication region in the second distribution plane and coupled to the first continuous layer and to the second continuous layer; and at least one externally accessible contact point coupled to at least one of the first and second layers. A method of forming a support circuit and a system including a package.

Selective reference plane bridge(s) on folded package

An electronic package is provided, having a flexible substrate, a first plurality of conductors, and a second plurality of conductors. The flexible substrate has first and second portions with a fold portion between the first and second portions, and is folded at the fold portion to position the second portion over the first portion. Each one of the first plurality of conductors runs from the first portion over the fold portion onto the second portion. Each one of the second plurality of conductors runs from the first portion onto the second portion without running over the fold portion.

Electronic package having a flexible substrate with ends connected to one another

A system may include an integrated circuit die, a package, and an interconnect. The integrated circuit die may include a conductive die pad, the package may include a conductive package pad, and the interconnect may include two or more stranded wires. A first end of the interconnect is electrically coupled to the conductive die pad, and a second end of the interconnect is electrically coupled to the package pad.

Growing community of inventors

Phoenix, AZ, United States of America

Edward W Jaeck