Avco Corporation

Avco Everett Research Laboratory, Inc.

Laser Corporation of America

W. J. Schafer Associates, Inc.

Edward V Locke

Daniel S Gnanamuthu

Edward C Borsare

Apparatus for simultaneously soldering all the leads of a multi-lead SMP device to the pads of a substrate utilizes a gas laser having a cylindrical resonant cavity terminated at one end by a mirror that reflects energy back into the laser cavity. A plurality of beamlets corresponding to the number of leads of the SMP device are coupled out of the laser through holes in the mirror. All the beamlets have substantially the same amount of radiant energy. Each beamlet enters the near end of a different one of a corresponding number of elongate flexible optical wave guides extending away from the mirror toward an imaging lens. The far end of each optical wave guide is arranged so that its position can be moved. That enables the far ends of the wave guides to be arranged in different patterns to match the various patterns of leads of different SMP devices. The beamlets emerging from the far ends of the optical wave guides are focussed by the imaging lens on the joints to be soldered. The radiant energy of those beamlets is turned into heat and causes the solder at the joints to reflow so that all the soldered connections are made at the same time.

Multi-lead laser soldering apparatus

The invention is concerned with novel pre-stressing of a reflecting surface such as a mirror, that is to be irradiated by a high energy laser beam or similar source, in such a manner that the beam-induced heating of the reflective surface causes a relaxation of the pre-stress that is designed to produce a surface distortion substantially equal and opposite to that caused by the heating.

Apparatus for compensating for thermally introduced distortions in

Properties of a surface layer of a metal part are modified by changing its composition and microstructure using focused radiant energy. Minor components of an alloy having the metal of the substrate as the major component thereof are applied to the surface and a limited depth surface layer of the substrate metal is melted, the coated-on components are mixed therewith and the mixture is rapidly cooled to produce a desired surfacing alloy to a controlled depth within the substrate and having a fine grained microstructure compared to the microstructure of the substrate metal. The amount of coated-on minor alloy components and the preselected depth of melting of the substrate metal provide alloy composition control. The melting is carried out by application of focused radiant energy using a laser, preferably applied in a manner to promote mixing of the coated-on minor alloy components and the molten substrate layer during the short time, on the order of tenths of a second, of molten state maintenance for any given surface area.

Surface modification

A process of cutting thick metal workpieces wherein a cutting laser beam is inclined back from a cutting direction and oscillated in a direction parallel with the cutting direction while a gas jet is directed from above the workpiece at an angle approximately normal to the direction of the laser beam incident on the workpiece to blow away the laser melted material as it is produced.

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Rockport, MA, United States of America

Edward V Locke