U.S. Philips Corporation

Dynamit Novel Aktiengesellschaft

Edward Uden

Friedrich Heinemeyer

Ulrich Steiner

Peter Roh

Johan C Finck

Wilhelm Schreihage

Johann Florin

An electronic delayed-action explosive detonator comprising a tubular case, a capacitor chargeable by pulses from a blasting machine, an integrated circuit for processing pulses from the blasting machine to set a delay time, the integrated circuit controlling the elapse of the delay time after the delay time has been set, a primer to which current is supplied upon elapse of the delay time for enabling detonation, and detonator wires extending from the tubular case for enabling connection of the blasting machine to at least one of the capacitor and integrated circuit. A supporting plate arrangement for carrying the integrated circuit is disposed in series with the capacitor within the tubular case. The supporting plate has a first contact area with connecting pads for enabling attachment of leads of the capacitor, and a second contact area with connecting pads for enabling attachment of the detonator wires which are within the tubular case and extend outwardly therefrom.

Electronic delayed-action explosive detonator

A data card having a lower covering film (2), a card body (3) and an upper covering foil (1), in which the card body (3) a carrier body (4) is present which is provided on one or both sides with conductor tracks (11, 12) and carries a semiconductor chip (5). In order to be able to contact the semiconductor chip (5) by means of conventional wire connections (7) and nevertheless not to exceed a thickness of 0.76 mm for the card, the carrier body (4) has the form of a film which is provided with a perforation (10) and in which the semiconductor chip (5) is disposed in the perforation (10) and is surrounded on the upper side of the carrier body (4) by a frame (8) and is covered with a covering mass (9). In the manufacture of such a card, the carrier body (4) provided with a perforation (10) is first covered on its lower side with a preferably self-adhering film (6), to which the semiconductor chip (5) is then adhered, while this film (6) is removed after the frame (8) and the covering mass (9) have been provided.

Data card and method of manufacturing same

An electronic module having two insulating substrates which are provided with printed wiring and which are connected to circuit elements, and mounted against opposite sides of a heat-dissipating body. The sides of the substrates are remote from the sides supporting the printed wiring and/or thin-layer circuit elements are glued to the heat-dissipating body which is between the substrates, and the required connection leads are enveloped by an insulating envelope.

Electronic component with heat cooled substrates

Growing community of inventors

Barmstedt, Germany

Edward Uden