Hermes Microvision Inc.

Edward Tseng

Zhongwei Chen

Joe Wang

Xuedong Liu

Xu Zhang

Jack Jau

Hong Xiao

Yi Xiang Wang

System and method for charged particle beam. According an embodiment, the present invention provides a charged particle beam apparatus. The apparatus includes a charged particle source for generating a primary charged particle beam. The apparatus also includes at least one condenser lens for pre-focusing the primary charge particle beam. Furthermore, the apparatus includes a compound objective lens for forming the magnetic field and the electrostatic field to focus the primary charged particle beam onto a specimen in the charged particle beam path. The specimen includes a specimen surface. The compound objective lens includes a conical magnetic lens, an immersion magnetic lens, and an electrostatic lens, the conical magnetic lens including an upper pole piece, a shared pole piece being electrically insulated from the upper pole piece, and an excitation coil.

System and method for a charged particle beam

The present invention relates to an operation stage of a charged particle beam apparatus which is employed in a scanning electron microscope for substrate (wafer) edge and backside defect inspection or defect review. However, it would be recognized that the invention has a much broader range of applicability. A system and method in accordance with the present invention provides an operation stage for substrate edge inspection or review. The inspection region includes top near edge, to bevel, apex, and bottom bevel. The operation stage includes a supporting stand, a z-stage, an X-Y stage, an electrostatic chuck, a pendulum stage and a rotation track. The pendulum stage mount with the electrostatic chuck has the ability to swing from 0&#xb0; to 180&#xb0; while performing substrate top bevel, apex and bottom bevel inspection or review. In order to keep the substrate in focus and avoid a large position shift during altering the substrate observation angle by rotation the pendulum stage, one embodiment of the present invention discloses a method such that the rotation axis of the pendulum stage consist of the tangent of upper edge of the substrate to be inspected. The electrostatic chuck of the present invention has a diameter smaller than which of the substrate to be inspected. During the inspection process the substrate on the electrostatic chuck may be rotated about the central axis on the electrostatic chuck to a desired position, this design insures all position on the bevel and apex are able to be inspected.

Operation stage for wafer edge inspection and review

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Jubei, Taiwan

Edward Tseng