International Business Machines Corporation

Edward Thomas Bernardo

Louis H Faure

Alfred H Johnson

Donald G Pittwood

A method of fabricating a semiconductor device mounting element embodying a wire fan-out wherein the ends of a plurality of insulated wires are supported in a spatial parallel arrangement of columns and rows between two spaced apertured die elements, the spacing of the wires is reduced at a first location between the die elements while maintaining the spatial arrangement of columns and rows, forming an enclosure about the wire portions positioned adjacent one of the die elements and the location where the spacing of the wires is reduced, injecting an organic hardenable resin material into the enclosure thereby encapsulating the wires positioned within, severing the wires, and removing the die. An apparatus for fabricating a semiconductor device mounting element embodying a fan-out arrangement of embedded wires, the apparatus having a pair of die elements each die element provided with a plurality of apertures arranged in columns and rows and adapted in an operation to receive and position insulated wires, the apertures in the dies being in axial alignment, a first set of parallel spaced wires, a second set of spaced parallel wires position in transverse relation to the first set of wires, a means to support the first and second set of spaced wires in a first widely spaced relationship and in a second closely spaced relationship, and a means to support the die elements in the first closed position and in the second open position, a means to load a plurality of insulated wires through the apertures in the pairs of die elements, a means to support the pair of dies in the first closed position and move the dies to a second open position, a means to move the first and second sets of parallel space wires to the second closely spaced relationship to compress the wires, a retractable mold that surrounds portions of the insulated wires positioned between one of the die elements and the location where the wires are compressed, and a means to introduce a hardenable resin material into the enclosure to thereby encapsulate the enclosed wires.

Method and apparatus for making a semiconductor device mounting element

The variable resist laminator receives a heated panel between two identical vacuum bails and the leading edge of a web of photoresist material is placed on opposite sides of the panel simultaneously prior to feeding the panel and attached webs between a pair of application rolls. Identical cutter mechanisms shear the webs into sheets of the desired length and the length may be varied for different length panels. Vacuum means are provided for maintaining control of the trailing edges of the cut sheets until they are applied to the panel to prevent the formation of wrinkles or other defects due to premature application. Vacuum means is also provided for removing flakes or debris as the webs are sheared. A gated conveyor system feeds the panels and the conveyor system has means for controlling the operation of the vacuum bails, the cutters, and the application rolls.

Growing community of inventors

Endicott, NY, United States of America

Edward Thomas Bernardo