Ferro Corporation

Edward Stadnicar, Jr

Gordon J Roberts

Dana Lynn Hankey

Kevin W Allison

The present invention provides a method of adherently depositing a thick film composition on an aluminum nitride substrate comprising the steps of providing an aluminum nitride substrate, providing a thick film composition, and applying the thick film composition on the aluminum nitride substrate. The thick film composition includes a glass frit binder, a conductive metallic material and a lithium-containing adhesion promoting compound.

Method of bonding a conductor composition including a lithium compound

A thick film paste composition adapted to be bonded onto an aluminum nitride substrate is provided which comprises (a) an electrical property regulating component present in an amount sufficient to control the electrical properties of said paste; (b) a lead free or low lead glass composition capable of bonding said electrical property regulating component to the surface of an aluminum nitride substrate.

Thick film paste compositions for use with an aluminum nitride substrate

A thick film conductor composition adapted to be bonded to an aluminum nitride substrate is provided which comprises a sufficient amount of conductive metallic material to render the conductor composition electrically conductive when bonded to the substrate, a glass frit binder for the metallic material capable of being bonded to the substrate, and a lithium containing compound capable of reacting with the substrate upon heating so as to aid in adherently bonding the conductor composition to the aluminum nitride substrate. A thick film conductor bonded onto the surface of an aluminum nitride substrate as well as a method of producing the same are also provided.

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Parma, OH, United States of America

Edward Stadnicar, Jr