Apple Inc.

Edward Siahaan

Daniel Ray Bloom

Phillip Qian

Eugene Antony Whang

Benjamin Andrew Shaffer

Christopher J Stringer

Matthew Dean Rohrbach

Eric Steven Jol

Erik L Wang

Albert John Golko

Dustin A Hatfield

Cameron P Frazier

John B Ardisana, Ii

Jared Mitchell Kole

Esge Brandt Andersen

Lee M Panecki

Christopher D Prest

Kurt R Stiehl

Jeffrey Y Hayashida

Wey-Jiun Lin

Victor Manuel Tiscareno

Mathias W Schmidt

David H Narajowski

Jeffrey J Terlizzi

Teodor Dabov

Naoto Matsuyuki

Dhaval N Shah

Scott Charles Grinker

Michael J Webb

Peter N Russell-Clarke

Scott A Myers

Robert W Schlub

Jue Wang

Colin M Ely

Douglas Joseph Weber

Mahmoud R Amini

Derek William Wright

Christopher D Jones

Jerzy S Guterman

Craig Matthew Stanley

Ethan Larry Huwe

Jason S Sloey

Arun Dhyaneshwar Chawan

John J Baker

Makiko K Brzezinski

Benjamin A Cousins

Hao Zhu

Jason Joseph LeBlanc

Daniel Max Strongwater

Tian Shi Li

Michael B Minerbi

Yoji Hamada

Zachary Segraves

Sean Thomas McIntosh

Kathleen A Bergeron

Miikka Olavi Tikander

Kevin M Keeler

Robert D Zupke

Ryan S Haley

Ian P Colahan

Hsiang Hung Chen

Nicholas G L Merz

Brian R Twehues

Qigen Ji

Edwin J Corona Aparicio

Ying-Liang Su

Whitney D Mattson

Sean J Docherty

Toni Ristoski

Scott Y Oshita

Audrey L Sheng

Nathan Morris

Jason C Della Rosa

Zachary C Rich

Dean F Darnell

Sneha Kadetotad

Yuta Kuboyama

Samuel G Parker

Siddhartha Hegde

Peter F Coxeter

Rajesh Anantharaman

Jarrett B Lagler

James G Griffin, Ii

Eric T SooHoo

Timon A Wright

Michael Brickner

Thanh Phong Hua

Christopher S Erickson

Tsu-Hui Lin

Mei Zhang

Meiting Wu

Peter J Cameron

Michael A Kinney

Ethan W Juhnke

Adam K Eschner

Haochuan Sang

John Ardisana

Rohan Gupta

Jacob E Mattingley

An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

Electronic device housing having a radio-frequency transmissive component

This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Headphones

Headphones with increased back volume

Systems and methods are provided for reducing unwanted noise in an electronic audio signal, wherein a computing device having a microphone is configured to receive signals from a sensor on an external device such as a camera, second microphone, or movement sensor. The signals from the sensor are used to identify sound information or characteristics of sounds made by a source of noise, and the audio signal of the microphone is modified to reduce unwanted sounds based on that sound information or based on sounds identified a second audio signal obtained by the second microphone, thereby improving teleconference and video conference audio quality and removing distracting noises from transmitted audio output.

Audio modification using interconnected electronic devices

This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.

Earbuds

This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

Headphones with a curved mesh headband

Support structure for earpiece cushion

Headphones with an anti-buckling assembly

Embodiments disclosed are directed to a woven fabric band that is capable of being secured to another object using threads or the band itself. The woven fabric band may include an inner layer having a first temperature melting point and an outer layer having a second temperature melting point that is higher than the first temperature melting point. When heat having the first temperature is applied to the woven fabric band, the inner layer of the woven fabric band melts while the outer layer remains in its original state. When the inner layer melts, the inner layer conforms to a first shape. As a result of the inner layer conforming to the first shape, the outer layer also conforms to the same shape.

Using woven fibers to increase tensile strength and for securing attachment mechanisms

Growing community of inventors

San Francisco, CA, United States of America

Edward Siahaan