General Instrument Corporation

Edward Shih

Muni M Mitchell

Mohammad Sedigh

Richard Shyr

The rectifier sub-assembly, formed by high temperature brazing, is glass encapsulated. It has axially extending leads with enlarged head portions. The sub-assembly is prepared for surface mounting by first flattening the leads outwardly from the enlarged head portions. An electrically insulating, heat conductive epoxy body is molded around the capsule, the enlarged head portions and at least a portion of each of the flattened lead sections. The leads are trimmed and if required, bent into the appropriate shape. After forming, the leads are barrel plated to obtain the best solderable surface for the most reliable electrical connection.

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Greenlawn, NY, United States of America

Edward Shih