Superconductor Technologies Inc.

Raytheon Company

Edward Robert Soares

Ashok Burton Tripathi

John J Drab

Gregory Lynton Hey-Shipton

James R Costa

Stacey M Bilski

Ken S Ono

Sunil Kapoor

Gena Marie Yates

An electronic device integration method and integrated electronic device. The integration method may include the steps of preparing a first electronic device by forming an electrically conductive trace overlying a substrate, forming a barrier layer overlying the electrically conductive trace, forming one or more electrically conductive interconnects on the barrier layer, and forming a bonding layer overlying the trace and/or at least partially surrounding the one or more interconnects. The barrier layer is configured to prevent formation of an intermetallic compound between the trace and interconnect structures, while still enabling electrical communication between the trace and interconnect. The integration method may further include the steps of direct bonding the first electronic device to a second electronic device, direct bonding a third electronic device to the second electronic device, and so on. A high-temperature treatment and functional testing of the vertically integrated electronic device may be conducted after each stack sequence.

Barrier layer for interconnects in 3D integrated device

Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.

Systems and methods for simple efficient assembly and packaging of electronic devices

Systems and methods for an upgradeable and/or reconfigurable receiver are provided. In general, the present invention is directed to providing systems and methods for designing an electronic communication system having easy and cost effective upgradeable receiver systems and components including, for example, an amplifier and/or a filter. For example, a receiver may include a receiver front end that is configured so that at least one of the original conventional system components may be used along with one or more new system components to provide greater receiver sensitivity and/or selectivity. In various embodiments, portions of an upgradeable receiver system may be made as modular components that allow easy replacement for the upgradeable components which may include a signal amplifier and/or a signal filter. In various embodiments the receiver may be upgraded by replacing a conventional low noise amplifier (LNA) with a high temperature superconductor (HTS) filter and/or a cryo-cooled LNA.

Systems and methods for receiver upgrade

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Lompoc, CA, United States of America

Edward Robert Soares