Vlsi Technology, Inc.

Edward R Vokoun, Iii

Miguel A Delgado

Brian D Richardson

Elizabeth A Chambers

Rajive Dhar

Gregory N Carter

Pierre Leroux

Anthony Sayka

Stacy W Hall

Bryan D Schmidt

Judy U Galloway

Daniel D Siems

Henry B Taylor, Iii

Charles G Shaw

A method for forming a scribe line on a semiconductor wafer including the steps of: (a) providing a semiconductor substrate; and (b) sequentially providing a plurality of layers over the semiconductor substrate of alternating conductive and insulating types, where each of the layers is provided with an elongated opening is formed relative to a desired scribe line position, and where the openings of at least some of the plurality of layers are wider than openings of preceding layers such that at least one sidewall of a completed scribe line has a pronounced slope extending outwardly from its base. The structure of the present invention is, therefore, a scribe line having sloped sidewalls that greatly reduces scribe line contamination problems and enhances planarization during subsequent spin-on-material processes. The scribe lines can either be elongated openings in the layers, or an elongated mesa formed in the layers.

Integrated circuit scribe line structures and methods for making same

Method and apparatus for detecting the presence of selected types of defects, such as chemical stains from a liquid photoresist material or a liquid dielectric material, on a non-visible chosen surface of a semiconductor water that has undergone at least one processing step. In one embodiment, a support substrate for, the wafer is provided that has a highly reflecting surface adjacent to the chosen surface. The reflecting surface and the chosen surface are moved apart, and the chosen surface is illuminated with light to form an optical image of the chosen surface. The optical image of the chosen surface is reflected in the reflecting surface, and the reflected optical image is examined for the presence of selected types of defects. In another embodiment, a portion of this reflecting surface is initially contiguous to the chosen surface. A selected defect, if any, on the chosen surface changes a surface characteristic of the reflecting surface so that the presence of this defect on the chosen surface is visually perceptible on the reflecting surface.

Semiconductor wafer defect monitoring

A reticle box characterized by a generally rectangular base member having a base portion and four contiguous wall portions, a generally rectangular cover member which can be engaged with the base member to fully enclose a reticle, and a closing mechanism which causes resilient stand-offs attached to the base member and the cover member to firmly grip the reticle within the box. Mating peripheral seals are provided around portions of the base member and the cover member to prevent the influx of contaminants. The cover member is of unitary design with an integral frame portion, central cover portion, and hinge. The reticle box is preferably made from a non-static plastic material.

Box for an optical stepper reticle

Growing community of inventors

Boerne, TX, United States of America

Edward R Vokoun, Iii