Nxp USA, Inc.

Blackberry Corporation

Edward Provo Wallis Horne

Joseph Staudinger

Matthew Russell Greene

Johannes Lambertus Holt

William E McKinzie, Iii

James H Martin

Peter Zahariev Rashev

Marina Zelner

Andrew Vladimir Claude Cervin

James Oakes

James Martin

A device includes an amplifier having an input terminal and an output terminal. The input terminal is configured to receive a radio frequency (RF) input signal. The device includes an output network coupled to the output terminal of the power amplifier and a first passively tunable integrated circuit (PTIC) coupled to the output network. The first PTIC includes a direct-current (DC) bias voltage input terminal configured to receive a fixed bias voltage, a control signal input terminal configured to receive a time-varying control signal, wherein the fixed bias voltage in combination with the time-varying control signal sets an operating reference point of the first PTIC, and an input terminal electrically connected to the output terminal of the amplifier, wherein a change in an output voltage signal generated by the power amplifier causes the first PTIC to modify a first effective impedance of a load presented to the power amplifier via the output network.

Dynamic power amplifier with external forcing signal

Aspects of the subject disclosure may include a Doherty amplifier that includes a carrier amplifier having an output terminal, an output network coupled to the output terminal, and a peaking amplifier, wherein the output network comprises a non-linear reactance component, and wherein the non-linear reactance component changes an effective impedance of a load presented to the carrier amplifier when the peaking amplifier is off. Other embodiments are disclosed.

RF power amplifier with extended load modulation

A system that incorporates teachings of the subject disclosure may include, for example, a thin film capacitor a silicon substrate having a silicon dioxide layer; an adhesion layer on the silicon dioxide layer, wherein the adhesion layer is a polar dielectric; a first electrode layer on the adhesion layer; a dielectric layer on the first electrode layer; and a second electrode layer on the dielectric layer. Other embodiments are disclosed.

Method and apparatus for a thin film dielectric stack

A system that incorporates teachings of the present disclosure may include, for example, a first solid electrode, a second electrode separated into subsections, and a dielectric medium separating the subsections from the first solid electrode, where the subsections of the second electrode include a first group of subsections and a second group of subsections, where the first group of subsections are connectable with a first terminal for receiving an input signal, and where the second group of subsections is connectable with a second terminal for providing an output signal. Other embodiments are disclosed.

Thin film capacitors

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Burlington, Canada

Edward Provo Wallis Horne