Visteon Global Technolgoies, Inc.

Vistoen Global Technologies, Inc.

Edward Paul McLeskey

Eric Myers

Ralph James Ross

James Driscoll

Lakhi Nandlal Goenka

Mohan R Paruchuri

Delin Li

Robert Edward Belke

Lawrence A Zurek

Scott Lee Straight

Jay DeAvis Baker

Vivek Amir Jairazbhoy

Cuong Van Pham

Achyuta Achari

Brenda Joyce Nation

John Frank Foss

Thomas Bernd Krautheim

Robert Edward Belke, Jr

Richard W Caron

Jun Ming Hu

Steven Michael Lutowsky, Jr

Alice Dawn Zitzmann

Leon Bogdanov

David J Thompson

A device for detecting a mass of a flowing fluid is disclosed. The device includes a housing having a fluid sampling portion and a circuit cavity portion. The fluid sampling portion is positionable within a fluid carrying duct and includes a flow passage. A nozzle is in fluid communication with the flow passage, wherein the nozzle has a nozzle exit. An electrical element is disposed in the flow passage proximate to the nozzle exit. Further, a circuit module is in communication with the electrical element and disposed in the circuit cavity portion for detecting a change in an electrical property of the electrical element, wherein the detected change in the electrical property is used to determine the mass of the flowing fluid. Finally, a homogenous lead frame having a connector pin portion and an electrical attachment portion for providing an electrical path from the electrical element and circuit module to the connector pin portion is provided.

Lead frame for automotive electronics

A mass fluid flow sensor for determining the amount of fluid inducted into an internal combustion engine, for example, is disclosed. The mass fluid flow sensor includes an external intake fluid temperature element which improves the accuracy of the mass fluid reading. An external cold wire element is further provided which improves response time. The mass fluid flow sensor has an improved aerodynamic design which provides a lower system pressure drop. Moreover, the sensor is smaller and lighter and has fewer parts, thus providing better manufacturability. A molded one-piece isolated jet nozzle having a hot element disposed therein is included in the fluid sampling portion. Consequently, an improved lower internal flow passage pressure drop is achieved. Additionally, an improved signal to noise ratio, as well as a larger dynamic range is an advantageous consequence of the present invention. The present invention further provides improved electromagnetic interference performance.

Fluid flow meter

The present invention involves a device for detecting a condition of a flowing fluid within a vehicle having reduced sulfur ingress. The device includes a base plate having a receiving surface and a circumferential edge and a printed circuit board disposed on the receiving surface of the base plate. The device further includes a housing having peripheral side walls attaching to the receiving surface adjacent the circumferential edge to define a peripheral interface enclosing the printed circuit board within the housing. The device further includes an adhesive material disposed at the interface to adhere the housing to the base plate. The adhesive material has a predetermined thermal expansion coefficient and a predetermined elastic modulus to reduce fluid ingress through the interface and to accommodate thermal expansions of the base plate and the housing.

Fluid flow device having reduced fluid ingress

A mass air flow sensor including a housing , an air foil element , and at least one sensor element mounted on the surface of the air foil element , whereby disruption to the air flow is minimized and performance of the mass air flow sensor in lower air flows is improved.

Mass air flow sensor bypass housing

A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

Method for constructing multilayer circuit boards having air bridges

A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

Method for making an electronic circuit assembly

Growing community of inventors

Whitmore Lake, MI, United States of America

Edward Paul McLeskey