Nextreme Thermal Solutions, Inc.

Other

Laird Durham, Inc.

Edward P Siivola

Rama Venkatasubramanian

Brooks O'Quinn

Thomas Colpitts

Pratima V Addepalli

Randall G Alley

Kip D Coonley

Ramaswamy Mahadevan

John Posthill

Anil J Reddy

Philip A Deane

Michael Puchan

Mary Napier

A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.

Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces

A method of forming a thermoelectric device may include forming a first electrically conductive trace, and bonding a thermoelectric element to the first electrically conductive trace. After bonding the thermoelectric element to the first electrically conductive trace, a metal post may be formed on the thermoelectric element so that the thermoelectric element is between the first electrically conductive trace and the metal post. After forming the metal post, the metal post may be bonded to a second electrically conductive trace so that the metal post is between the second electrically conductive trace and the thermoelectric element. Other related methods and structures are also discussed.

Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures

A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.

Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems

A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.

Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics

A thermoelectric device having at least one unipolar couple element () including two legs () of a same electrical conductivity type. A first-temperature stage () is connected to one of the two legs. A second-temperature stage () is connected across the legs of the at least one unipolar couple element. A third-temperature stage () is connected to the other of the two legs. Methods for cooling an object and for thermoelectric power conversion utilize the at least one unipolar couple element to respectively cool an object and produce electrical power.

Trans-thermoelectric device

A thermoelectric structure and device including at least first and second material systems having different lattice constants and interposed in contact with each other, and a physical interface at which the at least first and second material systems are joined with a lattice mismatch and at which structural integrity of the first and second material systems is substantially maintained. The at least first and second material systems have a charge carrier transport direction normal to the physical interface and preferably periodically arranged in a superlattice structure.

Phonon-blocking, electron-transmitting low-dimensional structures

A thermoelectric device and method of manufacturing the device, where thermoelectric elements of opposite conductivity type are located on respective opposing sides of a heat source member. Heat sinks are disposed on opposite sides of the thermoelectric elements. Peltier metal contacts are positioned between the thermoelectric elements and each of the heat source member and heat sinks. A plurality of devices may be arranged together in a thermally parallel, electrically series arrangement, or in a thermally parallel, electrically parallel arrangement. The arrangement of the elements allow the direction of current flow through the pairs of elements to be substantially the same as the direction of current flow through the metal contacts.

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Raleigh, NC, United States of America

Edward P Siivola