Raytheon Company

Edward Marsh Jackson

Clifton Quan

Fangchou Yang

Paul H Grobert

Kevin C Rolston

Hee Kyung Kim

David Brent Wilson

William K Wallace

Brian R Gonzales

Gennady Y Poberezhskiy

Jarrett M Perry

Phuoc T Ho

Matthew P Salkin, Sr

A method and apparatus for providing a standalone anti jamming (AJ) nuller-beamformer. Signals from an antenna array include a sum of Global Navigation Satellite System (GNSS) signals and jamming signals from a plurality of spatial sources. A front end is configured to amplify, filter, down-convert, and sample the input signals which are then filtered, down-converted, and decimated prior to frequency-domain and time-domain partitioning. Weights are computed and applied for spatial nulling of jamming signals in each frequency bin for the partitioned signals. Frequency and time-domain reconstruction generates a reconstructed signal with suppressed jamming.

Standalone GNSS anti-jam nuller-beamformer combining SFAP and STAP

An emitter identification system arranged to: receive a detected signal including one or more emitter signals from one or more emitters respectively where each of the emitter signals includes a unique signal characteristic related to a unique physical feature of a hardware structure associated with each of the emitters; apply a modulation signal to the detected signal to generate pulse in-phase and quadrature (IQ) data associated with the one or more emitter signals; extract one or more amplitude envelopes associated with the one or more emitter signals, where each amplitude envelope is related to the unique signal characteristic associated with each of the one or more emitters; estimate the unique signal characteristic of each of the one or more emitter signals; estimate a number of clusters related to a number of emitter signals; and identify each of the emitters by applying an unsupervised learning function.

Systems and methods for specific emitter identification

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

Multi-layer microwave corrugated printed circuit board and method

Growing community of inventors

Long Beach, CA, United States of America

Edward Marsh Jackson