International Business Machines Corporation

Edward M Wolf

Mark J Kuzawinski

An integrated circuit package comprises a set of bond fingers for connecting wire bonds from the chip, the bond fingers being placed overlapping on a transverse axis from the chip and extending inwardly and outwardly from vias positioned at different positions along the transverse axis, so that wire bonds connected to adjacent fingers have the same length.

Integrated circuit package with overlapping bond fingers

A plating tail connected to a signal trace for use during an electroplating operation is fabricated such that it has a substantially different impedance from the signal trace at a characteristic frequency in use, so that adverse reflections during operation are reduced below a threshold of significance.

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St. Albans, VT, United States of America

Edward M Wolf