International Business Machines Corporation

Edward Lee Arrington

Edmond Otto Fey

Anilkumar Chinuprasad Bhatt

Richard Ronald Hall

Thomas R Miller

John Joseph Konrad

Amit Kumar Sarkhel

Timothy Leroy Wells

Andrew Michael Seman

Jeffrey McKeveny

Kevin Taylor Knadle

Joseph Alphonse Kotylo

Robert Jeffrey Day

Jose A Rios

John Christopher Camp

Charles J Maira

Curtis Michael Gunther

John A Welsh

Joseph J Sniezek

Richard G Armant

Donald M Egleton

Frederick M Ortloff

A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

Method of fabricating printed circuit board with mixed metallurgy pads

Printed circuit board with mixed metallurgy pads and method of fabrication

A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g., with chlorite, permanganate, hydrogen peroxide, or air at a temperature elevated above ambient conditions); and d) removing the undesirable portions of the catalyst layer and the undesirable portions of the circuit pattern (e.g., with a cyanide submersion). The resultant circuitized substrate includes a circuit pattern on a catalyst layer wherein undesirable portions of the catalyst layer and circuit pattern are completely removed between the circuit features of the circuit pattern so that electrical leakage between the circuit features does not occur.

Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate

A compact tension testing apparatus for determining the peel strength of a circuit line or film bonded to a substrate. A force gauge is mounted on an apparatus using low friction air bearings to allow the force gauge to self-align with the peeling location of the circuit line or film, thereby providing essentially orthogonal positioning relative to the substrate.

Mini-tension tester

Process for removal of undersirable conductive material on a circuitized

A stripping composition containing O-dichlorobenzene, dodecylbenzene sulfonic acid, perchloroethylene, and optionally an aromatic hydrocarbon containing at least 8 carbon atoms, and use thereof for removing photoresist.

Phenolic-free stripping composition and use thereof

Growing community of inventors

Owego, NY, United States of America

Edward Lee Arrington